HUF75631SK8
Data Sheet
October 1999
File Number 4785
5.5A, 100V, 0.039 Ohm, N-Channel,
UltraFET Power MOSFET
Packaging
Features
JEDEC MS-012AA
• Ultra Low On-Resistance
- r = 0.039Ω, VGS = 10V
BRANDING DASH
DS(ON)
• Simulation Models
®
©
- Temperature Compensated PSPICE and SABER
Electrical Models
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©
- Spice and SABER Thermal Impedance Models
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2
3
4
- www.Intersil.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
Symbol
Ordering Information
SOURCE (1)
SOURCE (2)
SOURCE (3)
GATE (4)
DRAIN (8)
DRAIN (7)
DRAIN (6)
DRAIN (5)
PART NUMBER
PACKAGE
MS-012AA
BRAND
75631SK8
HUF75631SK8
NOTE: When ordering, use the entire part number. Add the suffix T
to obtain the variant in tape and reel, e.g., HUF75631SK8T.
o
Absolute Maximum Ratings T = 25 C, Unless Otherwise Specified
A
HUF75631SK8
UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
100
100
20
V
V
V
DSS
Drain to Gate Voltage (R
GS
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Drain Current
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Continuous (T = 25 C, V
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
5.5
3.5
A
A
A
GS
D
D
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Continuous (T = 100 C, V
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
A
GS
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Figure 4
DM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .UIS
Figures 6, 14, 15
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5
20
W
mW/ C
D
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Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T
J
-55 to 150
C
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
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300
260
C
C
L
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pkg
NOTES:
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1. T = 25 C to 150 C.
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2
2
2. 50 C/W measured using FR-4 board with 0.76 in (490.3 mm ) copper pad at 10 second.
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2
2
3. 152 C/W measured using FR-4 board with 0.054 in (34.8 mm ) copper pad at 1000 seconds
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2
2
4. 189 C/W measured using FR-4 board with 0.0115 in (7.42 mm ) copper pad at 1000 seconds
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
CAUTION: These devices are sensitive to electrostatic discharge. Follow proper ESD Handling Procedures.
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UltraFET™ is a trademark of Intersil Corporation. PSPICE™ is a registered trademark of MicroSim Corporation.
©
SABER is a Copyright of Analogy Inc. http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999