HUF75639S3R4851
TM
Data Sheet
April 2000
File Number 4854
56A, 115V, 0.025 Ohm, N-Channel
UltraFET Power MOSFET
This N-Channel power MOSFETs is manufactured using the
innovative UltraFET™ process. This advanced process
technology achieves the lowest possible on-resistance per
silicon area, resulting in outstanding performance. This
device is capable of withstanding high energy in the
avalanche mode and the diode exhibits very low reverse
recovery time and stored charge. It was designed for use in
applications where power efficiency is important, such as
switching regulators, switching converters, motor drivers,
relay drivers, low-voltage bus switches, and power
Features
• 56A, 115V
• Simulation Models
- Temperature Compensated PSPICETM and SABER
©
Electrical Models
- Spice and Saber Thermal Impedance Models
- www.Intersil.com
management in portable and battery-operated products.
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
Formerly developmental type TA75639.‘
Ordering Information
• Related Literature
- TB334, “Guidelines for Soldering Surface Mount
Components to PC Boards”
PART NUMBER
PACKAGE
BRAND
HUF75639S3R4851 TO-262AA
R4851
Packaging
NOTE: When ordering, use the entire part number.
JEDEC TO-262AA
Symbol
SOURCE
DRAIN
GATE
D
G
S
o
Absolute Maximum Ratings
T
= 25 C, Unless Otherwise Specified
C
HUF75639S3R4851
UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
115
115
±20
V
V
V
DSS
Drain to Gate Voltage (R
GS
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain Current
GS
Continuous (Figure 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
56
A
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Figure 4
DM
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
Figures 6, 14, 15
AS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
200
1.35
W
D
o
o
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
W/ C
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T
J
-55 to 175
C
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
o
300
260
C
C
L
o
pkg
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
o
o
1. T = 25 C to 150 C.
J
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright © Intersil Corporation 2000
PSPICE® is a registered trademark of MicroSim Corporation. | SABER™ is a trademark of Analogy, Inc.
UltraFET® is a registered trademark of Intersil Corporation.
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