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HUF75645S3S PDF预览

HUF75645S3S

更新时间: 2024-11-12 22:37:07
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关
页数 文件大小 规格书
10页 205K
描述
75A, 100V, 0.014 Ohm, N-Channel, UltraFET Power MOSFETs

HUF75645S3S 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:5.13外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):75 A最大漏极电流 (ID):75 A
最大漏源导通电阻:0.014 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):310 W认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

HUF75645S3S 数据手册

 浏览型号HUF75645S3S的Datasheet PDF文件第2页浏览型号HUF75645S3S的Datasheet PDF文件第3页浏览型号HUF75645S3S的Datasheet PDF文件第4页浏览型号HUF75645S3S的Datasheet PDF文件第5页浏览型号HUF75645S3S的Datasheet PDF文件第6页浏览型号HUF75645S3S的Datasheet PDF文件第7页 
HUF75645P3, HUF75645S3S  
Data Sheet  
December 2001  
75A, 100V, 0.014 Ohm, N-Channel,  
UltraFET® Power MOSFETs  
Packaging  
JEDEC TO-220AB  
JEDEC TO-263AB  
Features  
SOURCE  
DRAIN  
GATE  
DRAIN  
(FLANGE)  
• Ultra Low On-Resistance  
- r = 0.014Ω, VGS = 10V  
DS(ON)  
GATE  
• Simulation Models  
- Temperature Compensated PSPICE® and SABER™  
Electrical Models  
SOURCE  
DRAIN  
- Spice and Saber Thermal Impedance Models  
- www.fairchildsemi.com  
(FLANGE)  
HUF75645P3  
HUF75645S3S  
• Peak Current vs Pulse Width Curve  
• UIS Rating Curve  
Symbol  
D
S
Ordering Information  
PART NUMBER  
HUF75645P3  
PACKAGE  
TO-220AB  
TO-263AB  
BRAND  
75645P  
75645S  
G
HUF75645S3S  
NOTE: When ordering, use the entire part number. Add the suffix T  
to obtain the variant in tape and reel, e.g., HUF75645S3ST.  
o
Absolute Maximum Ratings  
T = 25 C, Unless Otherwise Specified  
C
HUF75645P3, HUF75645S3S  
UNITS  
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
100  
100  
±20  
V
V
V
DSS  
Drain to Gate Voltage (R  
= 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
GS  
DGR  
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
GS  
Drain Current  
o
Continuous (T = 25 C, V  
C
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
75  
65  
A
A
GS  
D
D
o
Continuous (T = 100 C, V  
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
C
GS  
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
Figure 4  
DM  
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS  
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P  
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
Figures 6, 14, 15  
310  
2.07  
W
W/ C  
D
o
o
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T  
J
-55 to 175  
C
STG  
Maximum Temperature for Soldering  
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
o
300  
260  
C
C
L
o
pkg  
NOTES:  
1. T = 25 C to 150 C.  
o
o
J
CAUTION: Stresses above those listed in “Absol24ute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
Product reliability information can be found at http://www.fairchildsemi.com/products/discrete/reliability/index.html  
For severe environments, see our Automotive HUFA series.  
All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.  
©2001 Fairchild Semiconductor Corporation  
HUF75645P3, HUF75645S3S Rev. B  

HUF75645S3S 替代型号

型号 品牌 替代类型 描述 数据表
FDB3632 FAIRCHILD

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