HUF75645P3, HUF75645S3S
Data Sheet
July 1999
File Number 4722.1
75A, 100V, 0.014 Ohm, N-Channel, UltraFET
Power MOSFETs
Packaging
Features
JEDEC TO-220AB
JEDEC TO-263AB
• Ultra Low On-Resistance
- r = 0.014Ω, VGS = 10V
DS(ON)
• Simulation Models
SOURCE
DRAIN
GATE
DRAIN
(FLANGE)
®
©
- Temperature Compensated PSPICE and SABER
Electrical Models
- Spice and Saber Thermal Impedance Models
- www.semi.intersil.com
GATE
SOURCE
DRAIN
(FLANGE)
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
HUF75645P3
HUF75645S3S
Ordering Information
Symbol
PART NUMBER
HUF75645P3
PACKAGE
TO-220AB
TO-263AB
BRAND
75645P
75645S
D
S
HUF75645S3S
G
NOTE: When ordering, use the entire part number. Add the suffix T
to obtain the variant in tape and reel, e.g., HUF75645S3ST.
o
Absolute Maximum Ratings
T = 25 C, Unless Otherwise Specified
C
HUF75645P3, HUF75645S3S
UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
100
100
20
V
V
V
DSS
Drain to Gate Voltage (R
GS
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Drain Current
o
Continuous (T = 25 C, V
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
75
65
A
A
C
GS
D
D
o
Continuous (T = 100 C, V
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
C
GS
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Figure 4
DM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .UIS
Figures 6, 14, 15
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
310
2.07
W
W/ C
D
o
o
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T
J
-55 to 175
C
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
o
300
260
C
C
L
o
pkg
NOTES:
1. T = 25 C to 150 C.
o
o
J
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
1
UltraFET™ is a trademark of Intersil Corporation. PSPICE® is a registered trademark of MicroSim Corporation.
©
SABER is a Copyright of Analogy Inc. 1-888-INTERSIL or 407-727-9207 | Copyright © Intersil Corporation 1999.