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HGTP10N40F1D

更新时间: 2024-09-16 22:32:55
品牌 Logo 应用领域
英特矽尔 - INTERSIL 二极管双极性晶体管
页数 文件大小 规格书
5页 37K
描述
10A, 400V and 500V N-Channel IGBTs with Anti-Parallel Ultrafast Diodes

HGTP10N40F1D 数据手册

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HGTP10N40F1D,  
HGTP10N50F1D  
10A, 400V and 500V N-Channel IGBTs  
with Anti-Parallel Ultrafast Diodes  
April 1995  
Features  
Package  
JEDEC TO-220AB  
• 10A, 400V and 500V  
• Latch Free Operation  
• Typical Fall Time < 1.4µs  
• High Input Impedance  
• Low Conduction Loss  
• Anti-Parallel Diode  
• tRR < 60ns  
EMITTER  
COLLECTOR  
GATE  
COLLECTOR  
(FLANGE)  
Description  
The IGBT is a MOS gated high voltage switching device combin-  
ing the best features of MOSFETs and bipolar transistors. The  
device has the high input impedance of a MOSFET and the low  
on-state conduction loss of a bipolar transistor. The much lower  
on-state voltage drop varies only moderately between +25oC  
and +150oC. The diode used in parallel with the IGBT is an  
ultrafast (tRR < 60ns) with soft recovery characteristic.  
Terminal Diagram  
N-CHANNEL ENHANCEMENT MODE  
C
IGBTs are ideal for many high voltage switching applications  
operating at frequencies where low conduction losses are  
essential, such as: AC and DC motor controls, power  
supplies and drivers for solenoids, relays and contactors.  
G
E
PACKAGING AVAILABILITY  
PART NUMBER  
HGTP10N40F1D  
HGTP10N50F1D  
PACKAGE  
TO-220AB  
TO-220AB  
BRAND  
10N40F1D  
10N50F1D  
NOTE: When ordering, use the entire part number  
o
Absolute Maximum Ratings T = +25 C, Unless Otherwise Specified  
C
HGTP10N40F1D  
HGTP10N50F1D  
UNITS  
Collector-Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BV  
400  
400  
12  
10  
12  
±20  
16  
10  
75  
500  
500  
12  
10  
12  
±20  
16  
10  
75  
V
V
A
A
A
V
A
A
W
CES  
CGR  
Collector-Gate Voltage R = 1M. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .BV  
GE  
o
Collector Current Continuous at T = +25 C . . . . . . . . . . . . . . . . . . . . . . . . . I  
C
C25  
C90  
o
at T = +90 C . . . . . . . . . . . . . . . . . . . . . . . . . I  
C
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I  
CM  
Gate-Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
GES  
o
Diode Forward Current at T = +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
C
F25  
F90  
o
at T = +90 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
C
o
Power Dissipation Total at T = +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P  
C
D
o
o
Power Dissipation Derating T > +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
0.6  
-55 to +150  
260  
0.6  
-55 to +150  
260  
W/ C  
C
o
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . T , T  
C
C
J
STG  
o
Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
L
NOTE:  
o
1. T = +150 C, Min. R = 25without latch.  
J
GE  
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS:  
4,364,073  
4,587,713  
4,641,162  
4,794,432  
4,860,080  
4,969,027  
4,417,385  
4,598,461  
4,644,637  
4,801,986  
4,883,767  
4,430,792  
4,605,948  
4,682,195  
4,803,533  
4,888,627  
4,443,931  
4,618,872  
4,684,413  
4,809,045  
4,890,143  
4,466,176  
4,620,211  
4,694,313  
4,809,047  
4,901,127  
4,516,143  
4,631,564  
4,717,679  
4,810,665  
4,904,609  
4,532,534  
4,639,754  
4,743,952  
4,823,176  
4,933,740  
4,567,641  
4,639,762  
4,783,690  
4,837,606  
4,963,951  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
File Number 2751.2  
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999  
3-25  

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