HGTP10N40F1D,
HGTP10N50F1D
10A, 400V and 500V N-Channel IGBTs
with Anti-Parallel Ultrafast Diodes
April 1995
Features
Package
JEDEC TO-220AB
• 10A, 400V and 500V
• Latch Free Operation
• Typical Fall Time < 1.4µs
• High Input Impedance
• Low Conduction Loss
• Anti-Parallel Diode
• tRR < 60ns
EMITTER
COLLECTOR
GATE
COLLECTOR
(FLANGE)
Description
The IGBT is a MOS gated high voltage switching device combin-
ing the best features of MOSFETs and bipolar transistors. The
device has the high input impedance of a MOSFET and the low
on-state conduction loss of a bipolar transistor. The much lower
on-state voltage drop varies only moderately between +25oC
and +150oC. The diode used in parallel with the IGBT is an
ultrafast (tRR < 60ns) with soft recovery characteristic.
Terminal Diagram
N-CHANNEL ENHANCEMENT MODE
C
IGBTs are ideal for many high voltage switching applications
operating at frequencies where low conduction losses are
essential, such as: AC and DC motor controls, power
supplies and drivers for solenoids, relays and contactors.
G
E
PACKAGING AVAILABILITY
PART NUMBER
HGTP10N40F1D
HGTP10N50F1D
PACKAGE
TO-220AB
TO-220AB
BRAND
10N40F1D
10N50F1D
NOTE: When ordering, use the entire part number
o
Absolute Maximum Ratings T = +25 C, Unless Otherwise Specified
C
HGTP10N40F1D
HGTP10N50F1D
UNITS
Collector-Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BV
400
400
12
10
12
±20
16
10
75
500
500
12
10
12
±20
16
10
75
V
V
A
A
A
V
A
A
W
CES
CGR
Collector-Gate Voltage R = 1MΩ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .BV
GE
o
Collector Current Continuous at T = +25 C . . . . . . . . . . . . . . . . . . . . . . . . . I
C
C25
C90
o
at T = +90 C . . . . . . . . . . . . . . . . . . . . . . . . . I
C
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
CM
Gate-Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GES
o
Diode Forward Current at T = +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
C
F25
F90
o
at T = +90 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
C
o
Power Dissipation Total at T = +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
C
D
o
o
Power Dissipation Derating T > +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
0.6
-55 to +150
260
0.6
-55 to +150
260
W/ C
C
o
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . T , T
C
C
J
STG
o
Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
L
NOTE:
o
1. T = +150 C, Min. R = 25Ω without latch.
J
GE
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS:
4,364,073
4,587,713
4,641,162
4,794,432
4,860,080
4,969,027
4,417,385
4,598,461
4,644,637
4,801,986
4,883,767
4,430,792
4,605,948
4,682,195
4,803,533
4,888,627
4,443,931
4,618,872
4,684,413
4,809,045
4,890,143
4,466,176
4,620,211
4,694,313
4,809,047
4,901,127
4,516,143
4,631,564
4,717,679
4,810,665
4,904,609
4,532,534
4,639,754
4,743,952
4,823,176
4,933,740
4,567,641
4,639,762
4,783,690
4,837,606
4,963,951
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
File Number 2751.2
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