是否无铅: | 含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | MODULE |
包装说明: | FLANGE MOUNT, R-XUFM-X39 | 针数: | 39 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
风险等级: | 5.08 | Is Samacsys: | N |
外壳连接: | ISOLATED | 最大集电极电流 (IC): | 130 A |
集电极-发射极最大电压: | 1200 V | 配置: | BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE |
门极-发射极最大电压: | 20 V | JESD-30 代码: | R-XUFM-X39 |
元件数量: | 6 | 端子数量: | 39 |
最高工作温度: | 150 °C | 封装主体材料: | UNSPECIFIED |
封装形状: | RECTANGULAR | 封装形式: | FLANGE MOUNT |
峰值回流温度(摄氏度): | NOT SPECIFIED | 极性/信道类型: | N-CHANNEL |
最大功率耗散 (Abs): | 660 W | 认证状态: | Not Qualified |
子类别: | Insulated Gate BIP Transistors | 表面贴装: | NO |
端子形式: | UNSPECIFIED | 端子位置: | UPPER |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 晶体管元件材料: | SILICON |
标称断开时间 (toff): | 390 ns | 标称接通时间 (ton): | 190 ns |
VCEsat-Max: | 3.7 V | Base Number Matches: | 1 |
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