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FDS4435BZ_07 PDF预览

FDS4435BZ_07

更新时间: 2024-01-27 13:57:14
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
6页 301K
描述
P-Channel PowerTrench㈢ MOSFET -30V, -8.8A, 20mヘ

FDS4435BZ_07 数据手册

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June 2007  
FDS4435BZ  
P-Channel PowerTrench® MOSFET  
-30V, -8.8A, 20mΩ  
Features  
General Description  
„ Max rDS(on) = 20mat VGS = -10V, ID = -8.8A  
„ Max rDS(on) = 35mat VGS = -4.5V, ID = -6.7A  
„ Extended VGSS range (-25V) for battery applications  
„ HBM ESD protection level of ±3.8KV typical (note 3)  
„ High performance trench technology for extremely low rDS(on)  
„ High power and current handling capability  
„ Termination is Lead-free and RoHS compliant  
This P-Channel MOSFET is produced using Fairchild  
Semiconductor’s advanced PowerTrench® process that has  
been especially tailored to minimize the on-state resistance.  
This device is well suited for Power Management and load  
switching applications common in Notebook Computers and  
Portable Battery Packs.  
D
D
D
D
D
D
D
D
4
3
G
S
S
5
6
7
8
2
1
G
S
S
S
S
Pin 1  
SO-8  
MOSFET Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
-30  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current -Continuous  
-Pulsed  
V
V
±25  
TA = 25°C  
(Note 1a)  
-8.8  
ID  
A
-50  
Power Dissipation  
TA = 25°C  
TA = 25°C  
(Note 1a)  
(Note 1b)  
(Note 4)  
2.5  
PD  
W
Power Dissipation  
1.0  
EAS  
Single Pulse Avalanche Energy  
24  
mJ  
°C  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
Thermal Characteristics  
RθJC  
RθJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
25  
50  
°C/W  
(Note 1a)  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
12mm  
Quantity  
FDS4435BZ  
FDS4435BZ  
SO-8  
13’’  
2500units  
1
©2007 Fairchild Semiconductor Corporation  
FDS4435BZ Rev.C  
www.fairchildsemi.com  

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