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FDP6690S PDF预览

FDP6690S

更新时间: 2024-11-20 22:40:51
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
6页 89K
描述
30V N-Channel PowerTrench SyncFET

FDP6690S 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TO-220AB包装说明:FLANGE MOUNT, R-PSFM-T3
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.92
雪崩能效等级(Eas):140 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):42 A
最大漏极电流 (ID):42 A最大漏源导通电阻:0.0155 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):48 W最大脉冲漏极电流 (IDM):140 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin/Lead (Sn85Pb15)
端子形式:THROUGH-HOLE端子位置:SINGLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDP6690S 数据手册

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SEPTEMBER 2001  
FDP6690S/FDB6690S  
30V N-Channel PowerTrenchÒ SyncFET™  
General Description  
Features  
This MOSFET is designed to replace a single MOSFET  
and parallel Schottky diode in synchronous DC:DC  
power supplies. This 30V MOSFET is designed to  
maximize power conversion efficiency, providing a low  
RDS(ON) and low gate charge. The FDP6690S includes  
an integrated Schottky diode using Fairchild’s  
monolithic SyncFET technology. The performance of  
the FDP6690S/FDB6690S as the low-side switch in a  
synchronous rectifier is indistinguishable from the  
performance of the FDP6035AL/FDB6035AL in parallel  
with a Schottky diode.  
·
21 A, 30 V.  
RDS(ON) = 15.5 mW @ VGS = 10 V  
RDS(ON) = 23.0 mW @ VGS = 4.5 V  
·
·
·
Includes SyncFET Schottky body diode  
Low gate charge (11nC typical)  
High performance trench technology for extremely  
low RDS(ON) and fast switching  
·
High power and current handling capability  
D
D
G
G
G
S
TO-263AB  
FDB Series  
TO-220  
FDP Series  
D
S
S
Absolute Maximum Ratings TA=25oC unless otherwise noted  
Symbol  
Parameter  
Ratings  
Units  
VDSS  
Drain-Source Voltage  
30  
V
VGSS  
ID  
Gate-Source Voltage  
V
A
±20  
42  
Drain Current – Continuous  
(Note 1)  
(Note 1)  
– Pulsed  
140  
PD  
W
W/°C  
°C  
Total Power Dissipation @ T = 25°C  
48  
0.5  
C
Derate above 25°C  
TJ, TSTG  
TL  
Operating and Storage Junction Temperature Range  
–55 to +150  
Maximum lead temperature for soldering purposes,  
1/8” from case for 5 seconds  
°C  
275  
Thermal Characteristics  
RqJC  
Thermal Resistance, Junction-to-Case  
2.6  
°C/W  
°C/W  
RqJA  
Thermal Resistance, Junction-to-Ambient  
62.5  
Package Marking and Ordering Information  
Device Marking  
Device  
Reel Size  
Tape width  
Quantity  
FDB6690S  
FDB6690S  
13’’  
24mm  
800 units  
45  
FDP6690S  
FDP6690S  
Tube  
n/a  
FDP6690S/FDB6690S Rev C (W)  
Ó 2001 Fairchild Semiconductor Corporation  

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