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FDP2552_NL

更新时间: 2024-11-26 13:07:47
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
11页 250K
描述
Power Field-Effect Transistor, 5A I(D), 150V, 0.036ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB, TO-220AB, 3 PIN

FDP2552_NL 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Obsolete零件包装代码:TO-220AB
包装说明:TO-220AB, 3 PIN针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.2Is Samacsys:N
雪崩能效等级(Eas):390 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:150 V
最大漏极电流 (Abs) (ID):5 A最大漏极电流 (ID):5 A
最大漏源导通电阻:0.036 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):150 W认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDP2552_NL 数据手册

 浏览型号FDP2552_NL的Datasheet PDF文件第2页浏览型号FDP2552_NL的Datasheet PDF文件第3页浏览型号FDP2552_NL的Datasheet PDF文件第4页浏览型号FDP2552_NL的Datasheet PDF文件第5页浏览型号FDP2552_NL的Datasheet PDF文件第6页浏览型号FDP2552_NL的Datasheet PDF文件第7页 
October 2002  
FDB2552 / FDP2552  
®
N-Channel PowerTrench MOSFET  
150V, 37A, 36mΩ  
Features  
Applications  
rDS(ON) = 32m(Typ.), VGS = 10V, ID = 16A  
Qg(tot) = 39nC (Typ.), VGS = 10V  
Low Miller Charge  
DC/DC Converters and Off-line UPS  
Distributed Power Architectures and VRMs  
Primary Switch for 24V and 48V Systems  
High Voltage Synchronous Rectifier  
Direct Injection / Diesel Injection Systems  
42V Automotive Load Control  
Low QRR Body Diode  
UIS Capability (Single Pulse and Repetitive Pulse)  
Qualified to AEC Q101  
Electronic Valve Train Systems  
Formerly developmental type 82869  
D
S
DRAIN  
(FLANGE)  
GATE  
SOURCE  
DRAIN  
GATE  
G
DRAIN  
SOURCE  
(FLANGE)  
TO-263AB  
FDB SERIES  
TO-220AB  
FDP SERIES  
MOSFET Maximum Ratings TC = 25°C unless otherwise noted  
Symbol  
VDSS  
VGS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current  
150  
V
V
±20  
Continuous (TC = 25oC, VGS = 10V)  
Continuous (TC = 100oC, VGS = 10V)  
Continuous (Tamb = 25oC, VGS = 10V) with RθJA = 43oC/W  
Pulsed  
37  
A
ID  
26  
5
A
A
Figure 4  
390  
A
EAS  
Single Pulse Avalanche Energy (Note 1)  
mJ  
Power dissipation  
Derate above 25oC  
150  
W
PD  
1.0  
W/oC  
oC  
TJ, TSTG  
Operating and Storage Temperature  
-55 to 175  
Thermal Characteristics  
RθJC  
RθJA  
RθJA  
Thermal Resistance Junction to Case TO-220, TO-263  
1.0  
62  
43  
oC/W  
oC/W  
oC/W  
Thermal Resistance Junction to Ambient TO-220, TO-263 (Note 2)  
Thermal Resistance Junction to Ambient TO-263, 1in2 copper pad area  
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a  
copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/  
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.  
All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems  
certification.  
©2002 Fairchild Semiconductor Corporation  
FDB2552 / FDP2552 Rev. B  

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