MOSFET - Power, Single
P-Channel, POWERTRENCH)
−20 V, −11 A, 13 mW
FDMA008P20LZ
General Description
This device is designed specifically for battery charge or load
switching in cellular handset and other ultraportable applications. It
features a MOSFET with low on−state resistance and zener diode
protection against ESD.
www.onsemi.com
Bottom Drain Contact
The WDFN6 (MicroFET 2.05×2.05) package offers exceptional
thermal performance for its physical size and is well suited to linear
mode applications.
1
6
D
D
G
D
D
S
2
3
5
4
Features
• Max r
• Max r
• Max r
• Max r
= 13 mW at V = −4.5 V, I = −2.5 A
GS D
DS(on)
DS(on)
DS(on)
DS(on)
= 16 mW at V = −2.5 V, I = −1.4 A
GS
D
= 20 mW at V = −1.8 V, I = −1.0 A
GS
D
= 30 mW at V = −1.5 V, I = −0.85 A
GS
D
D
D
• Low Profile − 0.8 mm Maximum − in the New Package WDFN6
S
Pin 1
(MicroFET 2.05 × 2.05 mm)
Drain
• HBM ESD Protection Level > 1 kV Typical (Note 3)
• Free from Halogenated Compounds and Antimony Oxides
• RoHS Compliant
Source
D
D
G
(Bottom View)
MOSFET MAXIMUM RATINGS (T = 25°C unless otherwise noted)
WDFN6 2.05x2.05, 0.65P
CASE 483AV
A
Symbol
Parameter
Drain to Source Voltage
Gate to Source Voltage
Ratings
−20
8
Unit
V
V
DS
V
GS
MARKING DIAGRAM
V
I
Drain Current
Continuous (Note 1a)
Pulsed (Note 5)
Single Pulse Avalanche Energy (Note 4)
−11
−164
54
A
D
&2&K
&Z008
E
AS
mJ
W
P
Power
Dissipation
(Note 1a)
(Note 1b)
2.4
D
0.9
&2 = Date Code
&K = Lot Code
&Z = Assembly Plant Code
008 = Specific Device Code
T , T
Operating and Storage Junction
Temperature Range
−55 to
+150
°C
J
STG
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
THERMAL CHARACTERITICS
Device
Marking
Symbol
Parameter
Ratings
52
Unit
{
Device
Package
Shipping
R
Thermal Resistance,
Junction to Ambient
(Note 1a)
(Note 1b)
°C/W
q
JA
008
FDMA008P20LZ
WDFN6
3000 Units/
Tape & Reel
(Pb−Free)
145
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
December, 2020 − Rev. 2
FDMA008P20LZ/D