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FDMA1024NZ PDF预览

FDMA1024NZ

更新时间: 2024-01-13 10:40:52
品牌 Logo 应用领域
安森美 - ONSEMI 开关光电二极管晶体管
页数 文件大小 规格书
8页 250K
描述
双 N 沟道,PowerTrench® MOSFET,20V,5.0A,54mΩ

FDMA1024NZ 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:MLP
包装说明:SMALL OUTLINE, S-PDSO-N6针数:6
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:3.92
外壳连接:DRAIN配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (Abs) (ID):5 A
最大漏极电流 (ID):5 A最大漏源导通电阻:0.054 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):65 pF
JEDEC-95代码:MO-229VCCCJESD-30 代码:S-PDSO-N6
JESD-609代码:e4湿度敏感等级:1
元件数量:2端子数量:6
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):1.4 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:NO LEAD端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDMA1024NZ 数据手册

 浏览型号FDMA1024NZ的Datasheet PDF文件第2页浏览型号FDMA1024NZ的Datasheet PDF文件第3页浏览型号FDMA1024NZ的Datasheet PDF文件第4页浏览型号FDMA1024NZ的Datasheet PDF文件第5页浏览型号FDMA1024NZ的Datasheet PDF文件第6页浏览型号FDMA1024NZ的Datasheet PDF文件第7页 
DATA SHEET  
www.onsemi.com  
MOSFET – Dual N-Channel,  
POWERTRENCH)  
Pin 1  
S1 G1 D2  
D1  
D2  
20 V, 5.0 A, 54 m  
FDMA1024NZ  
D1 G2 S2  
WDFN6 2x2, 0.65P  
(MicroFETt 2x2)  
CASE 511DA  
General Description  
This is designed specifically as a single package solution for dual  
switching requirements in cellular handset and other ultraportable  
applications. It features two independent NChannel MOSFETs with  
low onstate resistance for minimum conduction losses.  
The MicroFET t 2x2 package offers exceptional thermal  
performance for its physical size and is well suited to linear mode  
applications.  
MARKING DIAGRAM  
&Z&2&K  
024  
Features  
Max r  
Max r  
Max r  
Max r  
= 54 mW at V = 4.5 V, I = 5.0 A  
GS D  
DS(on)  
DS(on)  
DS(on)  
DS(on)  
= 66 mW at V = 2.5 V, I = 4.2 A  
GS  
D
&Z  
&2  
&K  
024  
= Assembly Plant Code  
= Numeric Date Code  
= Lot Code  
= 82 mW at V = 1.8 V, I = 2.3 A  
GS  
D
= 114 mW at V = 1.5 V, I = 2.0 A  
GS  
D
= Specific Device Code  
HBM ESD Protection Level = 1.6 kV (Note 3)  
Low Profile 0.8 mm Maximum in the New Package MicroFETt  
2 x 2 mm  
PIN ASSIGNMENT  
Free from Halogenated Compounds and Antimony Oxides  
This Device is PbFree and is RoHS Compliant  
S1  
1
6
5
4
D1  
G2  
Applications  
2
3
Baseband Switch  
Loadswitch  
DCDC Buck Converters  
G1  
D2  
S2  
MOSFET MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
Symbol  
Parameter  
Drain to Source Voltage  
Ratings Unit  
V
DS  
V
GS  
20  
8
V
V
A
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2  
of this data sheet.  
Gate to Source Voltage  
Drain Current Continuous (Note 1a)  
Pulsed  
I
D
5.0  
6.0  
1.4  
0.7  
P
D
Power Dissipation (Note 1a)  
Power Dissipation (Note 1b)  
W
T
STG  
Operating and Storage Junction Temperature  
Range  
55 to  
+150  
°C  
J,  
T
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
© Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
April, 2023 Rev. 3  
FDMA1024NZ/D  

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