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FDMA1029PZ PDF预览

FDMA1029PZ

更新时间: 2024-02-02 00:17:24
品牌 Logo 应用领域
安森美 - ONSEMI PC开关光电二极管晶体管
页数 文件大小 规格书
7页 173K
描述
双 P 沟道,PowerTrench® MOSFET,-20V,-3.1A,95mΩ

FDMA1029PZ 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:MLP
包装说明:SMALL OUTLINE, S-PDSO-N6针数:6
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.34
外壳连接:DRAIN配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (Abs) (ID):3.1 A
最大漏极电流 (ID):3.1 A最大漏源导通电阻:0.095 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:MO-229VCCC
JESD-30 代码:S-PDSO-N6JESD-609代码:e4
湿度敏感等级:1元件数量:2
端子数量:6工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:SQUARE封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):1.4 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:NO LEAD
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDMA1029PZ 数据手册

 浏览型号FDMA1029PZ的Datasheet PDF文件第2页浏览型号FDMA1029PZ的Datasheet PDF文件第3页浏览型号FDMA1029PZ的Datasheet PDF文件第4页浏览型号FDMA1029PZ的Datasheet PDF文件第5页浏览型号FDMA1029PZ的Datasheet PDF文件第6页浏览型号FDMA1029PZ的Datasheet PDF文件第7页 
DATA SHEET  
www.onsemi.com  
MOSFET – Dual, P-Channel,  
POWERTRENCH)  
V
R
MAX  
I MAX  
D
DS  
DS(ON)  
−20 V  
95 mW @ −4.5 V  
141 mW @ −2.5 V  
−3.1 A  
-20 V, -3.1 A, 95 W  
FDMA1029PZ  
PIN 1  
S1 G1 D2  
General Description  
This device is designed specifically as a single package solution for  
the battery charge switch in cellular handset and other ultra−portable  
applications. It features two independent P−Channel MOSFETs with  
low on−state resistance for minimum conduction losses. When  
connected in the typical common source configuration, bi−directional  
current flow is possible.  
D1  
D2  
D1 G2 S2  
WDFN6 2x2, 0.65P  
(MicroFET 2x2)  
CASE 511DA  
The MicroFET t 2x2 package offers exceptional thermal  
performance for its physical size and is well suited to linear mode  
applications  
Features  
MARKING DIAGRAM  
–3.1 A, –20 V  
R  
R  
= 95 mW @ V = –4.5 V  
GS  
DS(ON)  
&Z&2&K  
029  
= 141 mW @ V = –2.5 V  
DS(ON)  
GS  
Low Profile – 0.8 mm maximum – in the New Package MicroFET  
2x2 mm  
&Z = Assembly Plant Code  
&2 = 2−Digit Date Code  
&K = 2−Digits Lot Run Traceability Code  
029 = Specific Device Code  
HBM ESD Protection Level > 2.5 kV (Note 3)  
Free from halogenated compounds and antimony oxides  
This Device is Pb−Free, Halide Free and is RoHS Compliant  
MOSFET MAXIMUM RATINGS (T = 25°C, unless otherwise noted)  
A
Symbol  
Parameter  
Drain−Source Voltage  
Ratings  
−20  
Unit  
V
PIN ASSIGNMENT  
V
DS  
GS  
V
Gate−Source Voltage  
12  
V
S1  
G1  
D2  
1
2
3
6
5
4
D1  
G2  
S2  
I
Drain Current  
− Continuous (Note 1a)  
− Pulsed  
A
D
−3.1  
−6  
P
Power Dissipation for Single Operation  
(Note 1a)  
(Note 1b)  
W
D
1.4  
0.7  
T , T  
Operating and Storage Junction  
Temperature Range  
−55 to +150  
°C  
J
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 5 of  
this data sheet.  
THERMAL CHARACTERISTICS (T = 25°C, unless otherwise noted)  
A
Symbol  
Parameter  
Ratings  
Unit  
R
Thermal Resistance, Junction to Ambient  
(Note 1a)  
86 (Single  
Operation)  
°C/W  
q
q
q
q
JA  
JA  
JA  
JA  
R
R
R
Thermal Resistance, Junction to Ambient 173 (Single  
(Note 1b)  
Operation)  
Thermal Resistance, Junction to Ambient  
(Note 1c)  
69 (Dual  
Operation)  
°C/W  
Thermal Resistance, Junction to Ambient  
(Note 1d)  
151 (Dual  
Operation)  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
March, 2023 − Rev. 3  
FDMA1029PZ/D  

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