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FDMA1032CZ PDF预览

FDMA1032CZ

更新时间: 2024-02-29 14:35:58
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管开关光电二极管PC
页数 文件大小 规格书
9页 164K
描述
20V Complementary PowerTrench MOSFET

FDMA1032CZ 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:MLP
包装说明:SMALL OUTLINE, S-PDSO-N6针数:6
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.32
其他特性:ESD PROTECTION外壳连接:DRAIN
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (Abs) (ID):3.7 A最大漏极电流 (ID):3.7 A
最大漏源导通电阻:0.068 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:MO-229JESD-30 代码:S-PDSO-N6
JESD-609代码:e4湿度敏感等级:1
元件数量:2端子数量:6
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL AND P-CHANNEL最大功率耗散 (Abs):1.4 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:NO LEAD端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDMA1032CZ 数据手册

 浏览型号FDMA1032CZ的Datasheet PDF文件第2页浏览型号FDMA1032CZ的Datasheet PDF文件第3页浏览型号FDMA1032CZ的Datasheet PDF文件第4页浏览型号FDMA1032CZ的Datasheet PDF文件第5页浏览型号FDMA1032CZ的Datasheet PDF文件第6页浏览型号FDMA1032CZ的Datasheet PDF文件第7页 
May 2006  
FDMA1032CZ  
20V Complementary PowerTrench® MOSFET  
General Description  
Features  
This device is designed specifically as a single package  
solution for a DC/DC 'Switching' MOSFET in cellular  
handset and other ultra-portable applications. It  
Q1: N-Channel  
3.7 A, 20V.  
RDS(ON) = 68 m@ VGS = 4.5V  
RDS(ON) = 86 m@ VGS = 2.5V  
features an independent N-Channel  
& P-Channel  
Q2: P-Channel  
MOSFET with low on-state resistance for minimum  
conduction losses. The gate charge of each MOSFET  
is also minimized to allow high frequency switching  
directly from the controlling device. The MicroFET 2x2  
package offers exceptional thermal performance for its  
physical size and is well suited to switching applications.  
–3.1 A, –20V. RDS(ON) = 95 m@ VGS = –4.5V  
RDS(ON) = 141 m@ VGS = –2.5V  
Low profile – 0.8 mm maximum – in the new package  
MicroFET 2x2 mm  
RoHS Compliant  
PIN 1  
S1 G1 D2  
D1  
D2  
D1  
S1  
G1  
D2  
1
2
3
6
5
4
G2  
S2  
D1 G2 S2  
MicroFET 2x2  
Absolute Maximum Ratings TA=25oC unless otherwise noted  
Symbol  
VDS  
Parameter  
Drain-Source Voltage  
Q1  
20  
Q2  
–20  
±12  
–3.1  
–6  
Units  
V
VGS  
Gate-Source Voltage  
V
A
±12  
3.7  
6
Drain Current – Continuous  
– Pulsed  
(Note 1a)  
ID  
PD  
W
Power Dissipation for Single Operation  
(Note 1a)  
(Note 1b)  
1.4  
0.7  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
–55 to +150  
°C  
Thermal Characteristics  
Thermal Resistance, Junction-to-Ambient  
(Note 1a)  
(Note 1b)  
(Note 1c)  
(Note 1d)  
86 (Single Operation)  
173 (Single Operation)  
69 (Dual Operation)  
151 (Dual Operation)  
RθJA  
RθJA  
RθJA  
RθJA  
Thermal Resistance, Junction-to-Ambient  
Thermal Resistance, Junction-to-Ambient  
Thermal Resistance, Junction-to-Ambient  
°C/W  
Package Marking and Ordering Information  
Device Marking  
Device  
Reel Size  
Tape width  
Quantity  
032  
FDMA1032CZ  
7’’  
8mm  
3000 units  
FDMA1032CZ Rev B (W)  
©2006 Fairchild Semiconductor Corporation  

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