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FDMA1032CZ PDF预览

FDMA1032CZ

更新时间: 2024-11-08 11:11:27
品牌 Logo 应用领域
安森美 - ONSEMI PC开关光电二极管晶体管
页数 文件大小 规格书
9页 234K
描述
20V,互补,PowerTrench® MOSFET

FDMA1032CZ 技术参数

是否无铅:不含铅生命周期:Active
包装说明:SMALL OUTLINE, S-PDSO-N6Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
Factory Lead Time:16 weeks风险等级:0.96
Samacsys Confidence:4Samacsys Status:Released
Samacsys PartID:1010251Samacsys Pin Count:8
Samacsys Part Category:TransistorSamacsys Package Category:Other
Samacsys Footprint Name:MicroFET 2x2Samacsys Released Date:2018-12-30 16:13:53
Is Samacsys:N其他特性:ESD PROTECTION
外壳连接:DRAIN配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (Abs) (ID):3.7 A
最大漏极电流 (ID):3.7 A最大漏源导通电阻:0.068 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:MO-229
JESD-30 代码:S-PDSO-N6JESD-609代码:e4
湿度敏感等级:1元件数量:2
端子数量:6工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:SQUARE封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL AND P-CHANNEL
最大功率耗散 (Abs):1.4 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:NO LEAD
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDMA1032CZ 数据手册

 浏览型号FDMA1032CZ的Datasheet PDF文件第2页浏览型号FDMA1032CZ的Datasheet PDF文件第3页浏览型号FDMA1032CZ的Datasheet PDF文件第4页浏览型号FDMA1032CZ的Datasheet PDF文件第5页浏览型号FDMA1032CZ的Datasheet PDF文件第6页浏览型号FDMA1032CZ的Datasheet PDF文件第7页 
DATA SHEET  
www.onsemi.com  
MOSFET – POWERTRENCH),  
20ꢀV Complementary  
NChannel  
V
V
MAX  
R
I MAX  
D
DS  
DS(on)  
20 V  
68 m@ 4.5 V  
86 m@ 2.5 V  
3.7 A  
N-Channel: 20 V, 3.7 A, 68 mW  
P-Channel: -20 V, -3.1 A, 95 mW  
PChannel  
MAX  
R
I MAX  
D
DS  
DS(on)  
20 V  
95 m@ 4.5 V  
141 m@ 2.5 V  
3.1 A  
FDMA1032CZ  
General Description  
This device is designed specifically as a single package solution  
for a DC/DC “Switching” MOSFET in cellular handset and other  
ultraportable applications. It features an independent NChannel &  
PChannel MOSFET with low onstate resistance for minimum  
conduction losses. The gate charge of each MOSFET is also  
minimized to allow high frequency switching directly  
from the controlling device. The MicroFETt 2x2 package offers  
exceptional thermal performance for its physical size and is well  
suited to switching applications.  
Pin 1  
D1  
S1  
G1  
D2  
D2  
D1  
G2  
S2  
WDFN6 2x2, 0.65P  
(MicroFET)  
CASE 511DA  
Features  
MARKING DIAGRAM  
Q1: NChannel  
R  
R  
= 68 mat V = 4.5 V  
DS(on)  
GS  
= 86 mat V = 2.5 V  
&Z&2&K  
032  
DS(on)  
GS  
Q2: PChannel  
R  
R  
= 95 mat V = 4.5 V  
GS  
DS(on)  
= 141 mat V = 2.5 V  
DS(on)  
GS  
&Z = Assembly Plant Code  
&2 = 2Digit Date Code  
&K = 2Digits Lot Run Traceability Code  
Low Profile 0.8 mm Maximum In the New Package MicroFET  
2x2 mm  
032 = Device Code  
HBM ESD Protection Level > 2 kV (Note 3)  
Free from Halogenated Compounds and Antimony Oxides  
This Device is PbFree, Halide Free and is RoHS Compliant  
PIN CONNECTIONS  
1
2
3
6
5
4
D1  
S1  
G1  
D2  
G2  
S2  
ORDERING INFORMATION  
Shipping  
Device  
Package  
FDMA1032CZ  
WDFN6  
(PbFree,  
Halide Free)  
3000 /  
Tape & Reel  
For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
April, 2023 Rev. 3  
FDMA1032CZ/D  

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