DATA SHEET
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MOSFET – Dual, N-Channel,
POWERTRENCH)
V
R
MAX
I MAX
D
DS
DS(on)
30 V
123 mꢀ @ 4.5 V
140 mꢀ @ 3.0 V
163 mꢀ @ 2.5 V
2.9 A
30 V, 2.9 A, 123 mW
FDMA2002NZ
Pin 1
D1
S1
G1
D2
D2
General Description
D1
This device is designed specifically as a single package solution
for dual switching requirements in cellular handset and other
ultra−portable applications. It features two independent N−Channel
MOSFETs with low on−state resistance for minimum conduction
losses. The MicroFETt 2x2 offers exceptional thermal performance
for its physical size and is well suited to linear mode applications.
G2
S2
WDFN6 2x2, 0.65P
(MicroFET 2x2)
CASE 511DA
MARKING DIAGRAM
Features
• 2.9 A, 30 V
R
DS(on)
R
DS(on)
R
DS(on)
= 123 mꢀ at V = 4.5 V
GS
&Z&2&K
002
= 140 mꢀ at V = 3.0 V
GS
= 163 mꢀ at V = 2.5 V
GS
• Low Profile − 0.8 mm Maximum − In the New Package MicroFET
2x2 mm
&Z = Assembly Plant Code
• HBM ESD Protection Level > 1.8 kV (Note 3)
• Free from Halogenated Compounds and Antimony Oxides
• This Device is Pb−Free, Halide Free and is RoHS Compliant
&2 = 2−Digit Date Code
&K = 2−Digits Lot Run Traceability Code
002 = Device Code
PIN CONNECTIONS
S1
G1
D2
1
2
3
6
5
4
D1
G2
S2
ORDERING INFORMATION
†
Shipping
Device
Package
FDMA2002NZ
WDFN6
(Pb−Free,
Halide Free)
3000 /
Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
April, 2023 − Rev. 2
FDMA2002NZ/D