FDMA2002NZ
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted) (continued)
J
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
SWITCHING CHARACTERISTICS (Note 2)
t
t
Turn−On Delay Time
Turn−On Rise Time
Turn−Off Delay Time
Turn−Off Fall Time
Total Gate Charge
Gate−Source Charge
Gate−Drain Charge
V
V
= 15 V, I = 1 A
−
−
−
−
−
−
−
6
8
12
16
21
10
3.0
−
ns
ns
d(on)
DD
GS
D
= 4.5 V, R
= 6 ꢀ
GEN
t
r
12
ns
d(off)
t
f
2
ns
Q
V
DS
V
GS
= 15 V, I = 2.9 A,
2.4
0.35
0.75
nC
nC
nC
g
D
= 4.5 V
Q
gs
gd
Q
−
DRAIN−SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
Maximum Continuous Source−Drain Diode Forward Current
I
S
−
−
−
−
−
−
0.9
0.8
10
2
2.9
1.2
1.2
−
A
V
V
SD
Source−Drain Diode Forward Voltage
I = 2.0 A
S
I = 1.1 A
S
t
Diode Reverse Recovery Time
Diode Reverse Recovery Charge
I = 2.9 A, dI /dt = 100 A/ꢂ s
ns
rr
F
F
Q
−
nC
rr
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2
1. R
is determined with the device mounted on a 1 in oz. copper pad on a 1.5 x 1.5 in. board of FR−4 material. R
is guaranteed by design
JC
ꢁ
ꢁ
JA
while R
is determined by the user’s board design.
ꢁ
JA
2
a. R
= 83°C/W when mounted on a 1 in pad of 2 oz copper, 1.5” x 1.5” x 0.062” thick PCB. For single operation.
ꢁ
JA
JA
JA
JA
b. R
c. R
d. R
= 193°C/W when mounted on a minimum pad of 2 oz copper.. For single operation.
ꢁ
ꢁ
ꢁ
2
= 68°C/W when mounted on a 1 in pad of 2 oz copper, 1.5” x 1.5” x 0.062” thick PCB. For dual operation.
= 145°C/W when mounted on a minimum pad of 2 oz copper. For dual operation.
a. 83°C/W when
b. 193°C/W when
mounted on
c. 68°C/W when
d. 145°C/W when
mounted on
mounted on a 1
a
mounted on a
a
2
2
in pad of 2 oz
minimumpad of 2
oz copper.
1 in pad of 2
minimum pad of 2
oz copper.
copper.
oz copper.
2. Pulse Test: Pulse Width < 300 ꢂ s, Duty Cycle < 2.0%
3. The diode connected between the gate and source serves only as protection against ESD. No gate overvoltage rating is implied.
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3