DATA SHEET
www.onsemi.com
MOSFET – N-Channel,
POWERTRENCH),
Ultra Thin, 1.5 V
V
R
MAX
I
D MAX
DS
DS(on)
20 V
9.5 A
23 mW @ 4.5 V
Ultra Thin N−Channel
20 V, 9.5 A, 23 mW
Bottom Drain Contact
FDMA410NZT
D
D
1
2
3
6
5
4
D
D
S
Description
This Single N−Channel MOSFET has been designed using
onsemi’s advanced Power Trench process to optimize the R
@
DS(on)
G
V
= 1.5 V on special MicroFETt leadframe.
GS
This design is similar to the FDMA410NZ, however it features our
new advanced 0.55 mm max 2 x 2 MLP package technology.
Features
• 0.55 mm max package height MicroFET 2 x 2 mm Package
• Max R
• Max R
• Max R
• Max R
= 23 mW at V = 4.5 V, I = 9.5 A
GS D
DS(on)
DS(on)
DS(on)
DS(on)
= 29 mW at V = 2.5 V, I = 8.0 A
GS
D
= 36 mW at V = 1.8 V, I = 4.0 A
GS
D
= 60 mW at V = 1.5 V, I = 2.0 A
GS
D
• HBM ESD protection level > 1.5 kV (Note 3)
UDFN6 2.05x2,05 0.65P
(MicroFET)
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
CASE 517DT
Compliant
Typical Applications
• Li−lon Battery Pack
• Baseband Switch
• Load Switch
• DC−DC Conversion
• Mobile Device Switching
MARKING DIAGRAM
&Z&2&K
410T
&Z
&2
&K
= Assembly Plant Code
= Numeric Date Code
= Lot Code
410T
= Specific Device Code
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
April, 2023 − Rev. 3
FDMA410NZT/D