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FDMA530PZ_08 PDF预览

FDMA530PZ_08

更新时间: 2024-10-28 03:36:27
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
6页 877K
描述
Single P-Channel PowerTrench㈢ MOSFET

FDMA530PZ_08 数据手册

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April 2008  
FDMA530PZ  
tm  
Single P-Channel PowerTrench® MOSFET  
–30V, –6.8A, 35mΩ  
Features  
General Description  
„ Max rDS(on) = 35mΩ at VGS = –10V, ID = –6.8A  
This device is designed specifically for battery charge or load  
switching in cellular handset and other ultraportable  
applications . It features a MOSFET with low on-state resistance.  
„ Max rDS(on) = 65mΩ at VGS = –4.5V, ID = –5.0A  
„ Low profile - 0.8mm maximum - in the new package MicroFET  
2X2 mm  
The MicroFET 2X2 package offers exceptional thermal  
performance for its physical size and is well suited to linear mode  
applications.  
„ HBM ESD protection level > 3kV typical (Note 3)  
„ RoHS Compliant  
Pin 1  
G
D
D
Bottom Drain Contact  
1
D
6
D
Drain  
Source  
5
D
G
2
3
D
S
4
S
MicroFET 2X2 (Bottom View)  
D
D
MOSFET Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
–30  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current -Continuous  
-Pulsed  
V
V
±25  
(Note 1a)  
–6.8  
ID  
A
–24  
Power Dissipation  
(Note 1a)  
(Note 1b)  
2.4  
PD  
W
Power Dissipation  
0.9  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
–55 to +150  
°C  
Thermal Characteristics  
RθJA  
RθJA  
Thermal Resistance, Junction to Ambient  
Thermal Resistance, Junction to Ambient  
(Note 1a)  
(Note 1b)  
52  
°C/W  
145  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
8mm  
Quantity  
530  
FDMA530PZ  
MicroFET 2X2  
7’’  
3000 units  
1
©2008 Fairchild Semiconductor Corporation  
FDMA530PZ Rev.B1  
www.fairchildsemi.com  

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