May 2006
FDMA1028NZ
Dual N-Channel PowerTrench® MOSFET
General Description
Features
This device is designed specifically as a single package
solution for dual switching requirements in cellular
handset and other ultra-portable applications. It
features two independent N-Channel MOSFETs with
low on-state resistance for minimum conduction losses.
The MicroFET 2x2 package offers exceptional thermal
performance for its physical size and is well suited to
linear mode applications.
• 3.7 A, 20V.
RDS(ON) = 68 mΩ @ VGS = 4.5V
RDS(ON) = 86 mΩ @ VGS = 2.5V
• Low profile – 0.8 mm maximum – in the new package
MicroFET 2x2 mm
• RoHS Compliant
PIN 1
S1 G1 D2
D1
D2
D1
S1
G1
D2
1
2
3
6
5
4
G2
S2
D1 G2 S2
MicroFET 2x2
Absolute Maximum Ratings TA=25oC unless otherwise noted
Symbol
VDS
Parameter
Drain-Source Voltage
Ratings
Units
V
20
VGS
Gate-Source Voltage
V
A
±12
Drain Current – Continuous
– Pulsed
(Note 1a)
3.7
ID
6
1.4
PD
W
Power Dissipation for Single Operation
(Note 1a)
(Note 1b)
0.7
TJ, TSTG
Operating and Storage Junction Temperature Range
–55 to +150
°C
Thermal Characteristics
Thermal Resistance, Junction-to-Ambient
(Note 1a)
(Note 1b)
(Note 1c)
(Note 1d)
86 (Single Operation)
173 (Single Operation)
69 (Dual Operation)
151 (Dual Operation)
RθJA
RθJA
RθJA
RθJA
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Ambient
°C/W
Package Marking and Ordering Information
Device Marking
Device
Reel Size
Tape width
Quantity
028
FDMA1028NZ
7’’
8mm
3000 units
FDMA1028NZ Rev B (W)
©2006 Fairchild Semiconductor Corporation