DATA SHEET
www.onsemi.com
MOSFET – Dual, N-Channel,
POWERTRENCH)
V
MAX
R
MAX
I MAX
D
DS
DS(on)
20 V
68 mꢀ @ 4.5 V
86 mꢀ @ 2.5 V
3.7 A
20 V, 3.7 A, 68 mW
Pin 1
S1
FDMA1028NZ
G1
D2
D1
D2
General Description
D1
G2
This device is designed specifically as a single package solution
for dual switching requirements in cellular handset and other
ultra−portable applications. It features two independent N−Channel
MOSFETs with low on−state resistance for minimum conduction
losses. The MicroFETt 2x2 offers exceptional thermal performance
for its physical size and is well suited to linear mode applications.
S2
WDFN6 2x2, 0.65P
(MicroFET 2x2)
CASE 511DA
MARKING DIAGRAM
Features
• 3.7 A, 20 V
R
R
= 68 mꢀ at V = 4.5 V
GS
DS(on)
&Z&2&K
028
= 86 mꢀ at V = 2.5 V
DS(on)
GS
• Low Profile − 0.8 mm Maximum − In the New Package MicroFET
2x2 mm
• HBM ESD Protection Level > 2 kV (Note 3)
• Free from Halogenated Compounds and Antimony Oxides
• This Device is Pb−Free, Halide Free and is RoHS Compliant
&Z = Assembly Plant Code
&2 = 2−Digit Date Code
&K = 2−Digits Lot Run Traceability Code
028 = Device Code
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
PIN CONNECTIONS
Symbol
Parameter
Drain−Source Voltage
Ratings
20
Unit
V
V
DS
GS
D1
V
Gate−Source Voltage
12
V
1
2
3
S1
6
5
4
I
D
Drain Current
−Continuous (Note 1a)
−Pulsed
A
3.7
6
G1
D2
G2
S2
P
D
Power Dissipation for Single Operation
(Note 1a)
(Note 1b)
W
1.4
0.7
T , T
Operating and Storage Junction
Temperature Range
–55 to
+150
°C
J
STG
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
†
Shipping
Device
Package
THERMAL CHARACTERISTICS
FDMA1028NZ
WDFN6
(Pb−Free,
Halide Free)
3000 /
Tape & Reel
Symbol
Parameter
Ratings
Unit
Thermal Resistance,
86 (Single Operation)
°C/W
R
ꢁ
JA
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Junction to Ambient (Note 1a)
R
Thermal Resistance,
Junction to Ambient (Note 1b)
173 (Single Operation)
69 (Dual Operation)
151 (Dual Operation)
ꢁ
JA
R
Thermal Resistance,
Junction to Ambient (Note 1c)
ꢁ
JA
R
Thermal Resistance,
Junction to Ambient (Note 1d)
ꢁ
JA
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
April, 2023 − Rev. 3
FDMA1028NZ/D