DATA SHEET
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MOSFET – Dual, P-Channel,
POWERTRENCH)
V
R
MAX
I MAX
D
DS
DS(on)
−20 V
72 mꢀ @ −4.5 V
−3.7 A
95 mꢀ @ −2.5 V
130 mꢀ @ −1.8 V
195 mꢀ @ −1.5 V
-20 V, -3.7 A, 72 mW
FDMA1023PZ
General Description
Pin 1
D1
S1
G1
This device is designed specifically as a single package solution
for the battery charge switch in cellular handset and other
ultra−portable applications. It features two independent P−Channel
MOSFETs with low on−state resistance for minimum conduction
losses. When connected in the typical common source configuration,
bi−directional current flow is possible.
The MicroFET 2x2 package offers exceptional thermal
performance for its physical size and is well suited to linear mode
applications.
D2
D2
D1
G2
S2
WDFN6 2x2, 0.65P
(MicroFET 2x2)
CASE 511DA
MARKING DIAGRAM
Features
• Max R
• Max R
• Max R
• Max R
= 72 mꢀ at V = −4.5 V, I = −3.7 A
GS D
DS(on)
DS(on)
DS(on)
DS(on)
&Z&2&K
023
= 95 mꢀ at V = −2.5 V, I = −3.2 A
GS
D
= 130 mꢀ at V = −1.8 V, I = −2.0 A
GS
D
= 195 mꢀ at V = −1.5 V, I = −1.0 A
GS
D
• Low Profile − 0.8 mm Maximum − In the New Package MicroFET
2x2 mm
&Z = Assembly Plant Code
&2 = 2−Digit Date Code
&K = 2−Digits Lot Run Traceability Code
023 = Device Code
• HBM ESD Protection Level > 2 kV (Note 3)
• Free from Halogenated Compounds and Antimony Oxides
• This Device is Pb−Free, Halide Free and is RoHS Compliant
PIN CONNECTIONS
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
Symbol
Parameter
Drain to Source Voltage
Gate to Source Voltage
Ratings
Unit
V
D1
1
2
3
S1
G1
D2
6
5
4
V
DS
V
GS
−20
8
V
G2
S2
I
D
Drain Current
−Continuous (Note 1a)
−Pulsed
A
−3.7
−6
P
D
Power Dissipation
(Note 1a)
(Note 1b)
W
1.5
0.7
T , T
Operating and Storage Junction
Temperature Range
–55 to
+150
°C
J
STG
ORDERING INFORMATION
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
†
Shipping
Device
Package
FDMA1023PZ
WDFN6
(Pb−Free,
Halide Free)
3000 /
Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
April, 2023 − Rev. 4
FDMA1023PZ/D