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FDMA1023PZ-F106 PDF预览

FDMA1023PZ-F106

更新时间: 2024-01-10 09:42:24
品牌 Logo 应用领域
安森美 - ONSEMI 开关光电二极管晶体管
页数 文件大小 规格书
7页 228K
描述
双 P 沟道,Power Trench® MOSFET,-20V,-3.7A,72mΩ

FDMA1023PZ-F106 技术参数

是否无铅: 不含铅生命周期:Active
Reach Compliance Code:unknownFactory Lead Time:16 weeks
风险等级:5.69外壳连接:DRAIN
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (ID):3.7 A最大漏源导通电阻:0.072 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):135 pF
JEDEC-95代码:MO-229VCCCJESD-30 代码:S-PDSO-N6
元件数量:2端子数量:6
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:SQUARE封装形式:SMALL OUTLINE
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):1.5 W
表面贴装:YES端子形式:NO LEAD
端子位置:DUAL晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDMA1023PZ-F106 数据手册

 浏览型号FDMA1023PZ-F106的Datasheet PDF文件第2页浏览型号FDMA1023PZ-F106的Datasheet PDF文件第3页浏览型号FDMA1023PZ-F106的Datasheet PDF文件第4页浏览型号FDMA1023PZ-F106的Datasheet PDF文件第5页浏览型号FDMA1023PZ-F106的Datasheet PDF文件第6页浏览型号FDMA1023PZ-F106的Datasheet PDF文件第7页 
DATA SHEET  
www.onsemi.com  
MOSFET – Dual, P-Channel,  
POWERTRENCH)  
V
R
MAX  
I MAX  
D
DS  
DS(on)  
20 V  
72 m@ 4.5 V  
3.7 A  
95 m@ 2.5 V  
130 m@ 1.8 V  
195 m@ 1.5 V  
-20 V, -3.7 A, 72 mW  
FDMA1023PZ  
General Description  
Pin 1  
D1  
S1  
G1  
This device is designed specifically as a single package solution  
for the battery charge switch in cellular handset and other  
ultraportable applications. It features two independent PChannel  
MOSFETs with low onstate resistance for minimum conduction  
losses. When connected in the typical common source configuration,  
bidirectional current flow is possible.  
The MicroFET 2x2 package offers exceptional thermal  
performance for its physical size and is well suited to linear mode  
applications.  
D2  
D2  
D1  
G2  
S2  
WDFN6 2x2, 0.65P  
(MicroFET 2x2)  
CASE 511DA  
MARKING DIAGRAM  
Features  
Max R  
Max R  
Max R  
Max R  
= 72 mat V = 4.5 V, I = 3.7 A  
GS D  
DS(on)  
DS(on)  
DS(on)  
DS(on)  
&Z&2&K  
023  
= 95 mat V = 2.5 V, I = 3.2 A  
GS  
D
= 130 mat V = 1.8 V, I = 2.0 A  
GS  
D
= 195 mat V = 1.5 V, I = 1.0 A  
GS  
D
Low Profile 0.8 mm Maximum In the New Package MicroFET  
2x2 mm  
&Z = Assembly Plant Code  
&2 = 2Digit Date Code  
&K = 2Digits Lot Run Traceability Code  
023 = Device Code  
HBM ESD Protection Level > 2 kV (Note 3)  
Free from Halogenated Compounds and Antimony Oxides  
This Device is PbFree, Halide Free and is RoHS Compliant  
PIN CONNECTIONS  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
Symbol  
Parameter  
Drain to Source Voltage  
Gate to Source Voltage  
Ratings  
Unit  
V
D1  
1
2
3
S1  
G1  
D2  
6
5
4
V
DS  
V
GS  
20  
8
V
G2  
S2  
I
D
Drain Current  
Continuous (Note 1a)  
Pulsed  
A
3.7  
6  
P
D
Power Dissipation  
(Note 1a)  
(Note 1b)  
W
1.5  
0.7  
T , T  
Operating and Storage Junction  
Temperature Range  
–55 to  
+150  
°C  
J
STG  
ORDERING INFORMATION  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
Shipping  
Device  
Package  
FDMA1023PZ  
WDFN6  
(PbFree,  
Halide Free)  
3000 /  
Tape & Reel  
For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
April, 2023 Rev. 4  
FDMA1023PZ/D  

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