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CY62167DV30LL-55BVXIT PDF预览

CY62167DV30LL-55BVXIT

更新时间: 2024-11-25 14:56:11
品牌 Logo 应用领域
英飞凌 - INFINEON 静态存储器
页数 文件大小 规格书
18页 327K
描述
Asynchronous SRAM

CY62167DV30LL-55BVXIT 数据手册

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CY62167DV30 MoBL®  
16-Mbit (1 M × 16) Static RAM  
16-Mbit (1  
M × 16) Static RAM  
automatic power-down feature that significantly reduces power  
consumption by 99% when addresses are not toggling. The  
device can also be put into standby mode when deselected (CE1  
HIGH or CE2 LOW or both BHE and BLE are HIGH). The  
Features  
Thin small outline package (TSOP-I) configurable as  
1 M × 16 or as 2 M × 8 SRAM  
input/output pins (I/O0 through I/O15  
) are placed in a  
Wide voltage range: 2.2 V–3.6 V  
high-impedance state when: deselected (CE1 HIGH or CE2  
LOW), outputs are disabled (OE HIGH), both Byte High Enable  
and Byte Low Enable are disabled (BHE, BLE HIGH), or during  
a Write operation (CE1 LOW, CE2 HIGH and WE LOW).  
Ultra-low active power:  
Typical active current: 2 mA at f = 1 MHz  
Ultra-low standby power  
Writing to the device is accomplished by taking Chip Enables  
(CE1 LOW and CE2 HIGH) and Write Enable (WE) input LOW. If  
Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0  
through I/O7), is written into the location specified on the address  
pins (A0 through A19). If Byte High Enable (BHE) is LOW, then  
data from I/O pins (I/O8 through I/O15) is written into the location  
specified on the address pins (A0 through A19).  
Easy memory expansion with CE1, CE2 and OE features  
Automatic power-down when deselected  
Complementary metal oxide semiconductor (CMOS) for  
optimum speed / power  
Available in Pb-free and non Pb-free 48-ball very fine-pitch ball  
grid array (VFBGA) and 48-pin TSOP I package  
Reading from the device is accomplished by taking Chip Enables  
(CE1 LOW and CE2 HIGH) and Output Enable (OE) LOW while  
forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE)  
is LOW, then data from the memory location specified by the  
address pins appear on I/O0 to I/O7. If Byte High Enable (BHE)  
is LOW, then data from memory appear on I/O8 to I/O15. See the  
truth table at the back of this data sheet for a complete  
description of Read and Write modes.  
Functional Description  
The CY62167DV30 is a high-performance CMOS static RAM  
organized as 1M words by 16-bits. This device features  
advanced circuit design to provide ultra-low active current. This  
is ideal for providing More Battery Life(MoBL) in portable  
applications such as cellular telephones. The device also has an  
For a complete list of related documentation, click here.  
Logic Block Diagram  
DATA IN DRIVERS  
A10  
A 9  
A 8  
A 7  
A 6  
A 5  
A 4  
A 3  
1M × 16 / 2M x 8  
RAM Array  
I/O0–I/O7  
I/O8–I/O15  
A 2  
A 1  
A 0  
COLUMN DECODER  
BYTE  
BHE  
WE  
CE2  
CE1  
OE  
BLE  
Power-Down  
Circuit  
CE2  
CE1  
BHE  
BLE  
Cypress Semiconductor Corporation  
Document Number: 38-05328 Rev. *M  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised November 19, 2014  

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