CY62167E MoBL®
16-Mbit (1M x 16 / 2M x 8) Static RAM
(CE1 HIGH, or CE2 LOW, or both BHE and BLE are HIGH).
The input and output pins (IO0 through IO15) are placed in a
high impedance state when:
Features
• Configurable as 1M x 16 or as 2M x 8 SRAM
• Very high speed: 45 ns
• The device is deselected (CE1 HIGH or CE2 LOW)
• Outputs are disabled (OE HIGH)
• Wide voltage range: 4.5V–5.5V
• Ultra low standby power
• Both Byte High Enable and Byte Low Enable are disabled
(BHE, BLE HIGH) or
— Typical standby current: 1.5 µA
— Maximum standby current: 12 µA
• Ultra low active power
• A write operation is in progress (CE1 LOW, CE2 HIGH, and
WE LOW)
To write to the device, take Chip Enables (CE1 LOW and CE2
HIGH) and Write Enable (WE) input LOW. If Byte Low Enable
— Typical active current: 2.2 mA @ f = 1 MHz
• Easy memory expansion with CE1, CE2, and OE features
• Automatic power down when deselected
• CMOS for optimum speed and power
• Offered in 48-pin TSOP I package
(BLE) is LOW, then data from IO pins (IO0 through IO7), is
written into the location specified on the address pins (A0
through A19). If Byte High Enable (BHE) is LOW, then data
from the IO pins (IO8 through IO15) is written into the location
specified on the address pins (A0 through A19).
To read from the device, take Chip Enables (CE1 LOW and
CE2 HIGH) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins appears on IO0 to IO7. If Byte High Enable (BHE) is LOW,
then data from memory appears on IO8 to IO15. See the “Truth
Table” on page 10 for a complete description of read and write
modes.
Functional Description[1]
The CY62167E is a high performance CMOS static RAM
organized as 1M words by 16 bits/2M words by 8 bits. This
device features advanced circuit design to provide an ultra low
active current. This is ideal for providing More Battery Life™
(MoBL®) in portable applications such as cellular telephones.
The device also has an automatic power down feature that
reduces power consumption by 99% when addresses are not
toggling. Place the device into standby mode when deselected
Logic Block Diagram
DATA IN DRIVERS
A10
A 9
A 8
A 7
A 6
A 5
A 4
1M × 16 / 2M x 8
IO0–IO7
RAM ARRAY
A 3
IO8–IO15
A 2
A 1
A 0
COLUMN DECODER
BYTE
BHE
WE
CE2
CE2
CE
1
POWER DOWN
CIRCUIT
CE
1
OE
BHE
BLE
BLE
Note
1. For best practice recommendations, refer to the Cypress application note AN1064, SRAM System Guidelines.
Cypress Semiconductor Corporation
Document #: 001-15607 Rev. *A
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised June 07, 2007
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