CSD25301W1015
www.ti.com
SLPS210B –AUGUST 2009–REVISED OCTOBER 2010
P-Channel NexFET™ Power MOSFET
Check for Samples: CSD25301W1015
1
FEATURES
PRODUCT SUMMARY
•
•
•
•
•
•
•
Ultra Low Qg and Qgd
VDS
Qg
Drain to Source Voltage
Gate Charge Total (4.5V)
Gate Charge Gate to Drain
–20
1.9
V
Small Footprint
nC
nC
mΩ
mΩ
mΩ
V
Low Profile 0.62mm Height
Pb Free
Qgd
0.4
VGS = –1.5V
VGS = –2.5V
VGS = –4.5V
–0.75
175
80
RDS(on) Drain to Source On Resistance
RoHS Compliant
62
Halogen Free
VGS(th)
Voltage Threshold
CSP 1 × 1.5 mm Wafer Level Package
ORDERING INFORMATION
APPLICATIONS
Device
Package
Media
Qty
Ship
•
•
•
Battery Management
Load Switch
Battery Protection
1 × 1.5 Wafer
Level Package
Tape and
Reel
CSD25301W1015
7-inch reel
3000
ABSOLUTE MAXIMUM RATINGS
DESCRIPTION
TA = 25°C unless otherwise stated
VALUE
UNIT
V
VDS
VGS
ID
Drain to Source Voltage
–20
The device has been designed to deliver the lowest
on resistance and gate charge in the smallest outline
possible with excellent thermal characteristics in an
ultra low profile.
Gate to Source Voltage
±8
V
Continuous Drain Current, TC = 25°C(1)
Pulsed Drain Current, TA = 25°C(2)
Power Dissipation(1)
–2.2
–8.8
1.5
A
IDM
PD
A
W
Top View
TJ,
Operating Junction and Storage
–55 to 150
°C
TSTG Temperature Range
D
S
S
D
S
G
(1) RqJA = 85°C/W on 1in2 Cu (2 oz.) on 0.060" thick FR4 PCB.
(2) Pulse width ≤300ms, duty cycle ≤2%
P0099-01
RDS(ON) vs VGS
Gate Charge
300
250
200
150
100
50
6
I
V
= −1A
I
D
= −1A
D
= −10V
DS
5
4
3
2
1
0
T
= 125°C
C
T
= 25°C
C
0
0
1
2
3
4
5
6
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50
−V − Gate to Source Voltage − V
GS
Q − Gate Charge − nC
g
G006
G003
1
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PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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