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CSD25483F4

更新时间: 2024-11-29 12:49:47
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
12页 787K
描述
CSD25483F4, 20 V P-Channel FemtoFET MOSFET

CSD25483F4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:GRID ARRAY, R-XBGA-N3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95Factory Lead Time:6 weeks
风险等级:1.1最小漏源击穿电压:20 V
最大漏极电流 (Abs) (ID):1.6 AJESD-30 代码:R-XBGA-N3
湿度敏感等级:1工作模式:-0.95
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:GRID ARRAY峰值回流温度(摄氏度):260
表面贴装:YES端子形式:NO LEAD
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

CSD25483F4 数据手册

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CSD25483F4  
SLPS449B OCTOBER 2013REVISED FEBRUARY 2014  
CSD25483F4, 20 V P-Channel FemtoFET™ MOSFET  
.
1 Features  
Product Summary  
Drain-to-Source Voltage  
1
Ultra-Low On Resistance  
VDS  
Qg  
–20  
959  
V
Ultra-Low Qg and Qgd  
Gate Charge Total (–4.5 V)  
Gate Charge Gate to Drain  
pC  
pC  
m  
mΩ  
mΩ  
V
High Operating Drain Current  
Ultra-Small Footprint (0402 Case Size)  
Qgd  
161  
VGS = –1.8 V  
VGS = –2.5 V  
VGS = –4.5 V  
–0.95  
530  
338  
210  
RDS(on) Drain-to-Source On Resistance  
1.0 mm × 0.6 mm  
Ultra-Low Profile  
0.35 mm Max Height  
Integrated ESD Protection Diode  
VGS(th)  
Threshold Voltage  
.
Ordering Information  
Rated > 4 kV HBM  
Rated > 2 kV CDM  
Device  
Qty  
Media  
Package  
Ship  
CSD25483F4  
3000  
Femto (0402)  
1.0 mm x 0.6 mm  
Land Grid Array (LGA)  
7-Inch  
Reel  
Tape and  
Reel  
Lead and Halogen Free  
RoHS Compliant  
CSD25483F4T  
250  
.
2 Applications  
Absolute Maximum Ratings  
Optimized for Load Switch Applications  
TA = 25°C  
VALUE  
UNIT  
Optimized for General Purpose Switching  
Applications  
VDS  
VGS  
ID  
Drain-to-Source Voltage  
–20  
–12  
–1.6  
–6.5  
–35  
–350  
500  
4
V
V
A
A
Gate-to-Source Voltage  
Continuous Drain Current(1)  
Pulsed Drain Current(2)  
Battery Applications  
IDM  
Handheld and Mobile Applications  
Continuous Gate Clamp Current  
Pulsed Gate Clamp Current(2)  
Power Dissipation(1)  
IG  
mA  
3 Description  
PD  
mW  
kV  
This 210 mΩ, 20 V P-Channel FemtoFET™ MOSFET  
is designed and optimized to minimize the footprint in  
many handheld and mobile applications. This  
technology is capable of replacing standard small  
signal MOSFETs while providing at least a 60%  
reduction in footprint size.  
Human Body Model (HBM)  
Charged Device Model (CDM)  
ESD  
Rating  
2
kV  
TJ,  
TSTG  
Operating Junction and  
Storage Temperature Range  
–55 to 150  
°C  
(1) Typical RθJA = 85°C/W on 1-inch2 (6.45-cm2), 2-oz. (0.071-  
mm thick) Cu pad on a 0.06-inch (1.52-mm) thick FR4 PCB.  
.
(2) Pulse duration 300 μs, duty cycle 2%  
Typical Part Dimensions  
Top View  
0.35 mm  
D
0.60 mm  
1.00 mm  
G
S
.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
 
 
 
 
 
 

CSD25483F4 替代型号

型号 品牌 替代类型 描述 数据表
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