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BCP56T1/D PDF预览

BCP56T1/D

更新时间: 2024-11-04 23:34:55
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其他 - ETC 晶体晶体管
页数 文件大小 规格书
8页 97K
描述
NPN Silicon Epitaxial Transistor

BCP56T1/D 数据手册

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BCP56T1 Series  
Preferred Devices  
NPN Silicon  
Epitaxial Transistor  
These NPN Silicon Epitaxial transistors are designed for use in  
audio amplifier applications. The device is housed in the SOT-223  
package, which is designed for medium power surface mount  
applications.  
http://onsemi.com  
High Current: 1.0 Amp  
MEDIUM POWER  
NPN SILICON  
HIGH CURRENT  
TRANSISTOR  
The SOT-223 package can be soldered using wave or reflow. The  
formed leads absorb thermal stress during soldering, eliminating the  
possibility of damage to the die  
Available in 12 mm Tape and Reel  
Use BCP56T1 to order the 7 inch/1000 unit reel  
Use BCP56T3 to order the 13 inch/4000 unit reel  
SURFACE MOUNT  
PNP Complement is BCP53T1  
COLLECTOR 2,4  
Device Marking  
BCP56T1–10 = BH  
BCP56–10T1 = BH–10  
BCP56–16T1 = BH–16  
BASE  
1
EMITTER  
3
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Collector-Emitter Voltage  
Collector-Base Voltage  
Emitter-Base Voltage  
Collector Current  
Symbol  
Value  
80  
Unit  
Vdc  
Vdc  
Vdc  
Adc  
V
CEO  
V
CBO  
V
EBO  
MARKING DIAGRAM  
4
100  
5
1
2
BHxxx  
3
I
C
1
Total Power Dissipation  
P
D
CASE 318E  
TO–261AA  
STYLE 1  
@ T = 25°C (Note 1.)  
1.5  
12  
Watts  
mW/°C  
A
BHxxx = Device Code  
Derate above 25°C  
xxx  
= –10 or –16  
Operating and Storage  
Temperature Range  
T , T  
–65 to 150  
°C  
J
stg  
ORDERING INFORMATION  
THERMAL CHARACTERISTICS  
Characteristic  
Device  
Package  
SOT–223  
SOT–223  
SOT–223  
SOT–223  
SOT–223  
Shipping  
Symbol  
Max  
Unit  
Thermal Resistance  
Junction-to-Ambient  
(surface mounted)  
R
83.3  
°C/W  
θ
JA  
BCP56T1  
1000/Tape & Reel  
4000/Tape & Reel  
1000/Tape & Reel  
1000/Tape & Reel  
4000/Tape & Reel  
BCP56T3  
Maximum Temperature for  
Soldering Purposes  
Time in Solder Bath  
T
L
BCP56–10T1  
BCP56–16T1  
BCP56–16T3  
260  
10  
°C  
Sec  
1. Device mounted on a FR-4 glass epoxy printed circuit board 1.575 in. x  
1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in.  
Preferred devices are recommended choices for future use  
and best overall value.  
Semiconductor Components Industries, LLC, 2000  
1
Publication Order Number:  
September, 2000 – Rev. 2  
BCP56T1/D  

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