PD - 97583
AUTOMOTIVE GRADE
AUIRLR2905Z
Features
HEXFET® Power MOSFET
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Logic Level
Advanced Process Technology
UltraLowOn-Resistance
175°COperatingTemperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free,RoHSCompliant
D
V(BR)DSS
55V
13.5mΩ
60A
RDS(on) max.
ID (Silicon Limited)
ID (Package Limited)
G
S
42A
Automotive Qualified *
Description
D
Specifically designed for Automotive applications,
this HEXFET® Power MOSFET utilizes the latest
processing techniques to achieve extremely low on-
resistance per silicon area. Additional features of this
design are a 175°C junction operating temperature,
fast switching speed and improved repetitive ava-
lanche rating . These features combine to make this
design an extremely efficient and reliable device for
use in Automotive applications and a wide variety of
other applications.
S
G
D-Pak
AUIRLR2905Z
G
Gate
D
Drain
S
Source
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Ambient temperature (TA) is 25°C, unless otherwise specified.
Parameter
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V (Package Limited)
Pulsed Drain Current
Max.
60
Units
I
I
I
I
@ T = 25°C
C
D
D
D
@ T = 100°C
C
43
A
@ T = 25°C
C
42
240
110
DM
P
@T = 25°C
Power Dissipation
C
W
D
Linear Derating Factor
0.72
± 16
W/°C
V
V
Gate-to-Source Voltage
GS
EAS
57
mJ
Single Pulse Avalanche Energy (Thermally Limited)
Single Pulse Avalanche Energy Tested Value
Avalanche Current
EAS (tested )
85
IAR
See Fig.12a, 12b, 15, 16
A
EAR
mJ
Repetitive Avalanche Energy
T
J
-55 to + 175
Operating Junction and
T
°C
Storage Temperature Range
STG
Soldering Temperature, for 10 seconds (1.6mm from case )
Mounting Torque, 6-32 or M3 screw
300
10 lbf in (1.1N m)
Thermal Resistance
Parameter
Typ.
–––
–––
–––
Max.
1.38
40
Units
Rθ
JC
Junction-to-Case
Junction-to-Ambient (PCB mount)
Junction-to-Ambient
Rθ
Rθ
°C/W
JA
JA
110
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
10/28/2010