PD - 96369
AUTOMOTIVE GRADE
AUIRLR3110Z
AUIRLU3110Z
HEXFET® Power MOSFET
100V
Features
l
Advanced Process Technology
UltraLowOn-Resistance
175°COperatingTemperature
Fast Switching
D
S
l
l
l
l
l
l
VDSS
RDS(on) typ.
max.
ID (Silicon Limited)
ID (Package Limited)
11mΩ
Repetitive Avalanche Allowed up to Tjmax
Lead-Free,RoHSCompliant
14m
63A
Ω
G
Automotive Qualified *
42A
Description
D
Specifically designed for Automotive applications, this
HEXFET® Power MOSFET utilizes the latest processing
techniques to achieve extremely low on-resistance per
siliconarea. Additionalfeaturesofthisdesign area175°C
junction operating temperature, fast switching speed and
improved repetitive avalanche rating . These features
combine to make this design an extremely efficient and
reliable device for use in Automotive applications and a
wide variety of other applications.
S
D
S
G
G
I-Pak
AUIRLU3110Z
D-Pak
AUIRLR3110Z
G
D
S
Gate
Drain
Source
Absolute Maximum Ratings
StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.These
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated
in the specifications is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect
devicereliability.Thethermalresistanceandpowerdissipationratingsaremeasuredunderboardmountedandstillair
conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
Parameter
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
Max.
63
Units
(Silicon Limited)
(Silicon Limited)
(Package Limited)
I
I
I
I
@ T = 25°C
C
D
D
D
45
@ T = 100°C
C
A
42
@ T = 25°C
C
250
DM
140
Power Dissipation
W
W/°C
V
P
@T = 25°C
C
D
0.95
Linear Derating Factor
±16
Gate-to-Source Voltage
V
GS
EAS (Thermally limited)
110
140
Single Pulse Avalanche Energy
mJ
EAS (Tested )
Single Pulse Avalanche Energy Tested Value
Avalanche Current
IAR
See Fig.12a, 12b, 15, 16
A
EAR
Repetitive Avalanche Energy
mJ
-55 to + 175
Operating Junction and
T
T
J
Storage Temperature Range
°C
STG
300
Reflow Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or M3 screw
10 lbf in (1.1N m)
Thermal Resistance
Parameter
Typ.
–––
–––
–––
Max.
1.05
40
Units
RθJC
RθJA
RθJA
Junction-to-Case
Junction-to-Ambient (PCB mount)
Junction-to-Ambient
°C/W
110
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
05/03/11