PD - 97703A
AUTOMOTIVEGRADE
AUIRLR3105
Features
HEXFET® Power MOSFET
l AdvancedPlanarTechnology
l Logic-LevelGateDrive
Dynamic dV/dT Rating
l LowOn-Resistance
l 175°COperatingTemperature
l Fast Switching
l FullyAvalancheRated
l RepetitiveAvalancheAllowed
up to Tjmax
D
V(BR)DSS
55V
RDS(on) typ.
30m
37m
Ω
Ω
G
max
S
ID
25A
l Lead-Free,RoHSCompliant
l AutomotiveQualified*
D
Description
S
Specifically designed for Automotive applications,
this Stripe Planar design of HEXFET® Power
MOSFETs utilizes the latest processing techniques
to achieve low on-resistance per silicon area. This
benefit combined with the fast switching speed and
ruggedized device design that HEXFET power
MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use
in Automotive and a wide variety of other applications.
G
D-Pak
AUIRLR3105
G
Gate
D
S
Drain
Source
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Ambient temperature (TA) is 25°C, unless otherwise specified.
Max.
25
Parameter
Units
Continuous Drain Current, VGS @ 10V
@ T = 25°C
C
I
I
I
D
D
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
18
@ T = 100°C
A
C
100
DM
57
P
@T = 25°C Power Dissipation
W
W/°C
V
D
C
0.38
± 16
Linear Derating Factor
Gate-to-Source Voltage
V
GS
EAS
61
Single Pulse Avalanche Energy (Thermally Limited)
Single Pulse Avalanche Energy Tested Value
Avalanche Current
mJ
EAS (tested )
IAR
94
See Fig. 12a, 12b, 15, 16
A
EAR
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
mJ
3.4
dv/dt
V/ns
-55 to + 175
T
J
T
Storage Temperature Range
°C
STG
300
Soldering Temperature, for 10 seconds (1.6mm from case )
Thermal Resistance
Parameter
Typ.
–––
–––
–––
Max.
2.65
50
Units
RθJC
RθJA
RθJA
Junction-to-Case
Junction-to-Ambient (PCB Mount)
Junction-to-Ambient
°C/W
110
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
11/1/11