PD - 97734
AUTOMOTIVEGRADE
AUIRLR2908
Features
HEXFET® Power MOSFET
l AdvancedPlanarTechnology
l Logic-LevelGateDrive
l LowOn-Resistance
l 175°COperatingTemperature
l Fast Switching
D
V(BR)DSS
80V
RDS(on) typ.
max
ID (Silicon Limited)
22.5m
28m
39A
G
l FullyAvalancheRated
l RepetitiveAvalancheAllowed
up to Tjmax
S
ID (Package Limited)
30A
l Lead-Free,RoHSCompliant
l AutomotiveQualified*
D
Description
Specifically designed for Automotive applications,
this Stripe Planar design of HEXFET® Power
MOSFETs utilizes the latest processing techniques
to achieve low on-resistance per silicon area. This
benefit combined with the fast switching speed and
ruggedized device design that HEXFET power
MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use
in Automotive and a wide variety of other applications.
S
G
D-Pak
AUIRLR2908
G
D
S
Gate
Drain
Source
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Ambient temperature (TA) is 25°C, unless otherwise specified.
Max.
39
Parameter
Units
Continuous Drain Current, VGS @ 10V (Silicon Limited)
@ T = 25°C
C
I
I
I
I
D
D
D
28
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Package Limited)
Pulsed Drain Current
A
@ T = 100°C
C
30
@ T = 25°C
C
150
DM
120
0.77
± 16
P
@T = 25°C Power Dissipation
W
W/°C
V
D
C
Linear Derating Factor
Gate-to-Source Voltage
V
GS
EAS
AS (tested )
180
250
Single Pulse Avalanche Energy (Thermally Limited)
Single Pulse Avalanche Energy Tested Value
Avalanche Current
mJ
E
IAR
See Fig. 12a, 12b, 15, 16
A
EAR
dv/dt
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
mJ
2.3
V/ns
-55 to + 175
T
T
J
Storage Temperature Range
°C
STG
300
Soldering Temperature, for 10 seconds (1.6mm from case )
Thermal Resistance
Parameter
Typ.
–––
–––
–––
Max.
1.3
Units
RJC
RJA
RJA
Junction-to-Case
Junction-to-Ambient (PCB Mount)
Junction-to-Ambient
40
°C/W
110
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
10/17/11