PD - 97733
AUTOMOTIVE GRADE
AUIRF3315S
HEXFET® Power MOSFET
Features
l AdvancedPlanarTechnology
l LowOn-Resistance
D
VDSS
RDS(on) max.
150V
82m
l
Dynamic dV/dT Rating
l 175°COperatingTemperature
l Fast Switching
G
ID
21A
l
Fully Avalanche Rated
S
l Repetitive Avalanche Allowed up to
Tjmax
l Lead-Free,RoHSCompliant
l Automotive Qualified *
D
Description
S
Specifically designed for Automotive applications,
this cellular design of HEXFET® Power MOSFETs
utilizes the latest processing techniques to achieve
low on-resistance per silicon area. This benefit
combined with the fast switching speed and rugge-
dized device design that HEXFET power MOSFETs
are well known for, provides the designer with an
extremely efficient and reliable device for use in
Automotive and a wide variety of other applications.
D
G
D2Pak
AUIRF3315S
G
Gate
D
S
Drain
Source
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Ambient temperature (TA) is 25°C, unless otherwise specified.
Parameter
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Max.
21
Units
A
I
I
I
@ TC = 25°C
@ TC = 100°C
D
D
15
84
Pulsed Drain Current
DM
P
P
@TA = 25°C
@TC = 25°C
Maximum Power Dissipation
Maximum Power Dissipation
3.8
94
W
D
D
Linear Derating Factor
Gate-to-Source Voltage
0.63
± 20
W/°C
V
V
GS
EAS
IAR
Single Pulse Avalanche Energy
Avalanche Current
350
12
mJ
A
Repetitive Avalanche Energy
EAR
9.4
mJ
Peak Diode Recovery dv/dt
Operating Junction and
dv/dt
T
J
2.5
V/ns
°C
-55 to + 175
T
Storage Temperature Range
STG
Soldering Temperature, for 10 seconds (1.6mm from case )
300
Thermal Resistance
Parameter
Typ.
–––
Max.
1.6
Units
°C/W
Junction-to-Case
RJC
RJA
–––
40
Junction-to-Ambient (PCB Mount, steady state)
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
10/3/11