PD - 97697A
AUTOMOTIVE GRADE
AUIRF3808
HEXFET® Power MOSFET
Features
l Advanced Planar Technology
l Low On-Resistance
l Dynamic dv/dt Rating
l 175°C Operating Temperature
l Fast Switching
l Fully Avalanche Rated
l Repetitive Avalanche Allowed
up to Tjmax
D
V(BR)DSS
75V
RDS(on) typ.
5.9m
7.0m
G
max
S
ID
140A
l Lead-Free, RoHS Compliant
l Automotive Qualified*
D
Description
Specifically designed for Automotive applications,
this Stripe Planar design of HEXFET® Power
MOSFETs utilizes the latest processing techniques to
achieve low on-resistance per silicon area. This ben-
efit combined with the fast switching speed and rugge-
dized device design that HEXFET power MOSFETs
are well known for, provides the designer with an
extremely efficient and reliable device for use in Auto-
motive and a wide variety of other applications.
S
D
G
TO-220AB
AUIRF3808
G
Gate
D
Drain
S
Source
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the
specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Ambient temperature (TA) is 25°C, unless otherwise specified.
Max.
140
97
Parameter
Units
Continuous Drain Current, VGS @ 10V
@ T = 25°C
C
I
I
I
D
D
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
A
@ T = 100°C
C
550
DM
330
2.2
Power Dissipation
@T = 25°C
C
W
W/°C
V
P
D
Linear Derating Factor
Gate-to-Source Voltage
± 20
V
GS
EAS
IAR
430
Single Pulse Avalanche Energy (Thermally Limited)
mJ
82
See Fig. 12a, 12b, 15, 16
5.5
Avalanche Current
A
EAR
dv/dt
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
mJ
V/ns
-55 to + 175
T
T
J
Storage Temperature Range
°C
STG
300
Soldering Temperature, for 10 seconds (1.6mm from case )
Mounting Torque, 6-32 or M3 screw
10 lbf in (1.1N m)
Thermal Resistance
Parameter
Typ.
–––
Max.
0.45
–––
62
Units
RJC
RCS
RJA
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
0.50
–––
°C/W
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
11/15/11