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AUIRF3808

更新时间: 2024-11-07 21:09:43
品牌 Logo 应用领域
英飞凌 - INFINEON 局域网开关脉冲晶体管
页数 文件大小 规格书
12页 229K
描述
Power Field-Effect Transistor, 140A I(D), 75V, 0.007ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, ROHS COMPLIANT, PLASTIC PACKAGE-3

AUIRF3808 数据手册

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PD - 97697A  
AUTOMOTIVE GRADE  
AUIRF3808  
HEXFET® Power MOSFET  
Features  
l Advanced Planar Technology  
l Low On-Resistance  
l Dynamic dv/dt Rating  
l 175°C Operating Temperature  
l Fast Switching  
l Fully Avalanche Rated  
l Repetitive Avalanche Allowed  
up to Tjmax  
D
V(BR)DSS  
75V  
RDS(on) typ.  
5.9m  
7.0m  
G
max  
S
ID  
140A  
l Lead-Free, RoHS Compliant  
l Automotive Qualified*  
D
Description  
Specifically designed for Automotive applications,  
this Stripe Planar design of HEXFET® Power  
MOSFETs utilizes the latest processing techniques to  
achieve low on-resistance per silicon area. This ben-  
efit combined with the fast switching speed and rugge-  
dized device design that HEXFET power MOSFETs  
are well known for, provides the designer with an  
extremely efficient and reliable device for use in Auto-  
motive and a wide variety of other applications.  
S
D
G
TO-220AB  
AUIRF3808  
G
Gate  
D
Drain  
S
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the  
specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Max.  
140  
97  
Parameter  
Units  
Continuous Drain Current, VGS @ 10V  
@ T = 25°C  
C
I
I
I
D
D
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
A
@ T = 100°C  
C
550  
DM  
330  
2.2  
Power Dissipation  
@T = 25°C  
C
W
W/°C  
V
P
D
Linear Derating Factor  
Gate-to-Source Voltage  
± 20  
V
GS  
EAS  
IAR  
430  
Single Pulse Avalanche Energy (Thermally Limited)  
mJ  
82  
See Fig. 12a, 12b, 15, 16  
5.5  
Avalanche Current  
A
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Operating Junction and  
mJ  
V/ns  
-55 to + 175  
T
T
J
Storage Temperature Range  
°C  
STG  
300  
Soldering Temperature, for 10 seconds (1.6mm from case )  
Mounting Torque, 6-32 or M3 screw  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
0.45  
–––  
62  
Units  
RJC  
RCS  
RJA  
Junction-to-Case  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
0.50  
–––  
°C/W  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
11/15/11  

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