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AUIRF3710ZS PDF预览

AUIRF3710ZS

更新时间: 2024-11-25 12:49:59
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
14页 359K
描述
HEXFET® Power MOSFET

AUIRF3710ZS 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:ROHS COMPLIANT, D2PAK-3Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:16 weeks
风险等级:0.67Is Samacsys:N
雪崩能效等级(Eas):200 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (Abs) (ID):59 A
最大漏极电流 (ID):59 A最大漏源导通电阻:0.018 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-XSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):160 W
最大脉冲漏极电流 (IDM):240 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

AUIRF3710ZS 数据手册

 浏览型号AUIRF3710ZS的Datasheet PDF文件第2页浏览型号AUIRF3710ZS的Datasheet PDF文件第3页浏览型号AUIRF3710ZS的Datasheet PDF文件第4页浏览型号AUIRF3710ZS的Datasheet PDF文件第5页浏览型号AUIRF3710ZS的Datasheet PDF文件第6页浏览型号AUIRF3710ZS的Datasheet PDF文件第7页 
PD - 97470  
AUIRF3710Z  
AUIRF3710ZS  
AUTOMOTIVE GRADE  
HEXFET® Power MOSFET  
Features  
O
O
O
O
O
Low On-Resistance  
175°C Operating Temperature  
Fast Switching  
Fully Avalanche Rated  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free, RoHS Compliant  
Automotive Qualified *  
D
VDSS = 100V  
RDS(on) = 18mΩ  
O
O
G
ID = 59A  
Description  
S
SpecificallydesignedforAutomotiveapplications,  
this HEXFET® Power MOSFET utilizes the latest  
processing techniques to achieve extremely low  
on-resistance per silicon area. Additional fea-  
turesofthisdesign area175°Cjunctionoperating  
temperature, fast switching speed and improved  
repetitive avalanche rating . These features com-  
bine to make this design an extremely efficient  
and reliable device for use in Automotive applica-  
tions and a wide variety of other applications.  
D2Pak  
AUIRF3710ZS  
TO-220AB  
AUIRF3710Z  
Absolute Maximum Ratings  
StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice. Thesearestressratingsonly;  
and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure  
to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation  
ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Continuous Drain Current, VGS @ 10V  
Max.  
59  
Units  
A
I
I
I
@ TC = 25°C  
D
@ TC = 100°C Continuous Drain Current, VGS @ 10V  
42  
D
240  
160  
Pulsed Drain Current  
DM  
P
@TC = 25°C  
Maximum Power Dissipation  
W
D
Linear Derating Factor  
Gate-to-Source Voltage  
1.1  
± 20  
W/°C  
V
V
GS  
Single Pulse Avalanche Energy (Thermally limited)  
EAS  
170  
200  
mJ  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
EAS (tested)  
IAR  
See Fig.12a,12b,15,16  
A
EAR  
Repetitive Avalanche Energy  
Operating Junction and  
mJ  
°C  
T
J
-55 to + 175  
T
Storage Temperature Range  
STG  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
0.92  
–––  
40  
Units  
°C/W  
Junction-to-Case  
RθJC  
RθCS  
RθJA  
Case-to-Sink, Flat, Greased Surface  
0.50  
–––  
Junction-to-Ambient (PCB Mount, steady state)  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
3/19/10  

AUIRF3710ZS 替代型号

型号 品牌 替代类型 描述 数据表
IRF3710ZSTRLPBF INFINEON

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Power Field-Effect Transistor, 59A I(D), 100V, 0.018ohm, 1-Element, N-Channel, Silicon, Me
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HEXFET® Power MOSFET
IRF3710ZSPBF INFINEON

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