WTM503P075LK-HAF
P-Channel Enhancement Mode MOSFET
Drain
Features
• Advanced trench cell design
• High speed switch
Gate
• Halogen and Antimony Free(HAF),
RoHS compliant
• Built-in G-S Protection Diode
• Typical ESD Protection HBM Class 2
Source
1.Source 2.Source 3.Source 4.Gate
5.Drain 6.Drain 7.Drain 8.Drain
DFN5060 Plastic Package
Classification Voltage Range(V)
0A
0B
1A
1B
1C
2
< 125
Key Parameters
125 to < 250
250 to < 500
500 to < 1000
1000 to < 2000
2000 to < 4000
4000 to < 8000
≥ 8000
Parameter
-V(BR)DSS
Value
30
Unit
V
7.5 @ -VGS = 10 V
11.5 @ -VGS = 4.5 V
1.5
RDS(ON) Max
mΩ
-VGS(th) typ
Qg typ
V
3A
3B
112 @ -VGS = 10 V
nC
Applications
• Portable appliances
• Battery management
Absolute Maximum Ratings (at Ta = 25℃ unless otherwise specified)
Parameter
Symbol
-VDS
Value
30
Unit
Drain-Source Voltage
Gate-Source Voltage
V
V
VGS
± 20
Tc = 25℃
Tc = 100℃
62
39
Drain Current
-ID
A
Peak Drain Current 1)
Avalanche Current
Avalanche Energy 2)
Power Dissipation
-IDM
-IAS
300
58.1
A
A
EAS
168.8
mJ
W
℃
PD
41.1
Tc = 25℃
Operating Junction and Storage Temperature Range
TJ,Tstg
- 55 to + 150
Thermal Characteristics
Parameter
Symbol
RθJC
Max.
3
Unit
Thermal Resistance from Junction to Case
℃
℃
/W
/W
Thermal Resistance from Junction to Ambient 3)
1) Pulse Test: Pulse Width ≤ 100 μs, Duty Cycle ≤ 2%, Repetitive rating, pulse width limited by junction temperature TJ(MAX) = 150°C.
2) Limited by TJ(MAX), starting TJ = 25 °C, L = 0.1 mH, Rg = 25 Ω, -IAS = 58.1 A, VGS = 10 V.
RθJA
39
3) Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air.
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Dated: 13/03/2023 Rev: 03