WTM504N019L-HAF
N-Channel Enhancement Mode MOSFET
Drain
Features
• Advanced trench Cell Design
• Low Thermal Resistance
• Halogen and Antimony Free(HAF),
RoHS compliant
Gate
1.Source 2.Source 3.Source 4.Gate
5.Drain 6.Drain 7.Drain 8.Drain
DFN5060 Plastic Package
Source
Applications
• DC - DC Converter
• Motor drivers
Key Parameters
Parameter
BVDSS
Value
40
Unit
V
1.9 @ VGS = 10 V
3 @ VGS = 4.5 V
2
RDS(ON) Max
mΩ
VGS(th) typ
Qg typ
V
70 @ VGS = 10 V
nC
Absolute Maximum Ratings (at Ta = 25℃ unless otherwise specified)
Parameter
Symbol
Value
40
Unit
V
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
± 20
V
Tc = 25℃
110
69
Continuous Drain Current
ID
A
Tc = 100℃
Peak Drain Current, Pulsed 1)
Avalanche Current
IDM
IAS
320
A
A
45
101
Single Pulse Avalanche Energy 2)
Power Dissipation
EAS
mJ
W
℃
PD
35
Tc = 25℃
Operating Junction and Storage Temperature Range
TJ, Tstg
- 55 to + 150
Thermal Characteristics
Parameter
Symbol
RθJC
Max.
3.5
Unit
Thermal Resistance from Junction to Case
℃
℃
/W
/W
Thermal Resistance from Junction to Ambient 3)
1) Pulse Test: Pulse Width ≤ 100 μs, Duty Cycle ≤ 2%, Repetitive rating, pulse width limited by junction temperature TJ(MAX) = 150°C.
2) Limited by TJ(MAX), starting TJ = 25 °C, L = 0.1 mH, Rg = 25 Ω, IAS = 45 A, VGS = 10 V.
RθJA
62.5
3) Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air.
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®
Dated: 18/08/2023 Rev: 03