是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
包装说明: | PLASTIC, BGA-119 | Reach Compliance Code: | unknown |
风险等级: | 5.92 | Is Samacsys: | N |
最长访问时间: | 3.8 ns | 其他特性: | PIPELINED ARCHITECTURE |
JESD-30 代码: | R-PBGA-B119 | 长度: | 22 mm |
内存密度: | 75497472 bit | 内存集成电路类型: | SRAM MODULE |
内存宽度: | 36 | 功能数量: | 1 |
端子数量: | 119 | 字数: | 2097152 words |
字数代码: | 2000000 | 工作模式: | SYNCHRONOUS |
组织: | 2MX36 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
座面最大高度: | 2.5 mm | 最大供电电压 (Vsup): | 2.625 V |
最小供电电压 (Vsup): | 2.375 V | 标称供电电压 (Vsup): | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 14 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
WED2ZL362MSJ | ETC |
获取价格 |
NBL SSRAM MCP |
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WED2ZL362MSJ28BC | WEDC |
获取价格 |
SRAM Module, 2MX36, 2.8ns, CMOS, PBGA119, PLASTIC, BGA-119 |
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WED2ZL362MSJ28BI | WEDC |
获取价格 |
SRAM, |
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WED2ZL362MSJ30BI | WEDC |
获取价格 |
SRAM Module, 2MX36, 3ns, CMOS, PBGA119, PLASTIC, BGA-119 |
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WED2ZL362MSJ35BC | WEDC |
获取价格 |
SRAM Module, 2MX36, 3.5ns, CMOS, PBGA119, PLASTIC, BGA-119 |
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WED2ZL362MSJ35BI | WEDC |
获取价格 |
SRAM Module, 2MX36, 3.5ns, CMOS, PBGA119, PLASTIC, BGA-119 |
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WED2ZL362MSJ35ES | WEDC |
获取价格 |
SRAM Module, 2MX36, 3.5ns, CMOS, PBGA119, PLASTIC, BGA-119 |
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WED2ZL362MSJ38BI | WEDC |
获取价格 |
SRAM Module, 2MX36, 3.8ns, CMOS, PBGA119, PLASTIC, BGA-119 |
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WED2ZL362MSJ38ES | WEDC |
获取价格 |
SRAM Module, 2MX36, 3.8ns, CMOS, PBGA119, PLASTIC, BGA-119 |
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WED2ZL64512S | WEDC |
获取价格 |
512K x 64 Synchronous Pipeline NBL SRAM |
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