Datasheet > WED2ZL362MSJ30BI

WED2ZL362MSJ30BI

更新时间： 2023-08-15 00:00:00

品牌	Logo	应用领域
WEDC		静态存储器
页数	文件大小	规格书
2页	507K
描述
SRAM Module, 2MX36, 3ns, CMOS, PBGA119, PLASTIC, BGA-119

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获取价格

数据手册

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WED2ZL362MSJ30BI 数据手册

72Mb; 2M x 36 Synchronous

Pipeline Burst NBL SRAM

Optimum Density and Performance

in One Package

WED2ZL362MSxxBC/BI

WED2ZL362MSJxxBC/BI

The WED2ZL362MS and the WED2ZL362MSJ are members of WEDC’s

high density/high performance synchronous SRAM family designed in

support of network processors, DSPs and high performance general

processors.

The devices are organized as 2M x 36, include the no bus latency (NBL)

feature as well as pipeline burst and are packaged in a 14mm x 22mm,

119 BGA. The WED2ZL362MS and the WED2ZL362MSJ operate at 2.5V.

Benefits

Product Features

Operating voltage: 2.5V

50% space savings

•

Fast clock speeds: 225, 200, 166, and 150MHz

•

Easier PCB layout and routing

Fast access times: 2.8, 3.0, 3.5 and 3.8ns

No bus latency (100% ZBT^™compatible) feature

■

•

Reduced trace lengths

•

■

50% fewer active signal

Snooze mode for ultra low standby power

•

connections on system board

Individual byte write control

•

Improved system performance

•

Clock controlled and registered address, control

and I/O

•

■

Reduced package inductance

■

Reduced package capacitance

Burst mode (interleaved or linear)

•

- 50% reduction compared

to two 14mm x 22mm,

119 BGA packages

Low capacitance bus loading

Package

14mm x 22mm, 119 BGA, 1.27mm pitch

Pick-and-place assembly

•

ZBT™ is a trademark of Integrated Device Technology.

This product is subject to change without notice.

WEDC’s product literature uses NBL, no bus latency to describe ZBT compatible devices.

For more information, visit our website at

www.wedc.com or call (602) 437-1520

and ask for multi-chip product marketing.

White Electronic Designs

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