5秒后页面跳转
捷配首页

Datasheet > WED2ZLRSP01S-BC
WED2ZLRSP01S-BC PDF预览

WED2ZLRSP01S-BC

更新时间： 2024-02-24 18:04:33
品牌 Logo 应用领域
其他 - ETC 静态存储器
页数 文件大小 规格书
13页 560K
描述
NBL SSRAM MCP

阅读下载

中文翻译

获取价格

WED2ZLRSP01S-BC 数据手册

 浏览型号WED2ZLRSP01S-BC的Datasheet PDF文件第2页浏览型号WED2ZLRSP01S-BC的Datasheet PDF文件第3页浏览型号WED2ZLRSP01S-BC的Datasheet PDF文件第4页浏览型号WED2ZLRSP01S-BC的Datasheet PDF文件第5页浏览型号WED2ZLRSP01S-BC的Datasheet PDF文件第6页浏览型号WED2ZLRSP01S-BC的Datasheet PDF文件第7页 
n
n
n
n
n
n
n
Fast clock speed: 166, 150, 133, and 100MHz  
Fast access times: 3.5ns, 3.8ns, 4.2ns, and 5.0ns  
Fast OE access times: 3.5ns, 3.8ns, 4.2ns, and 5.0ns  
Single +2.5V 5% power supply (VDD)  
Snooze Mode for reduced-standby power  
Individual Byte Write control  
The WED2ZLRSP01S, Dual Independent Array, NBL-SSRAM  
device employs high-speed, Low-Power CMOS silicon and  
is fabricated using an advanced CMOS process. WEDC’s  
24Mb, Sync Burst SRAM MCP integrates two totally inde-  
pendent arrays, the first organized as a 512K x 32, and the  
second a 256K x 32.  
All Synchronous inputs pass through registers controlled  
by a positive edge triggered, single clock input per array.  
The NBL or No Bus Latency Memory provides 100% bus  
utilizaton, with no loss of cycles caused by change in modal  
operation (Write to Read/Read to Write). All inputs except  
for Asynchronous Output Enable and Burst Mode control  
are synchronized on the positive or rising edge of Clock.  
Burst order control must be tied either HIGH or LOW, Write  
cycles are internally self-timed, and writes are initiated on  
the rising edge of clock. This feature eliminates the need  
for complex off-chip write pulse generation and proved  
increased timing flexibility for incoming signals.  
Clock-controlled and registered addresses, data I/Os  
and control signals  
n
n
Burst control (interleaved or linear burst)  
Packaging:  
• 209-bump BGA package  
Low capacitive bus loading  
n
1
2
3
4
5
6
7
8
9
10  
11  
VSS  
NC  
A
B
C
D
E
VSS  
A_DATB  
A_DATB  
A_ADR  
VSS  
A_DATB A_DATB A_DATB  
1 2  
VSS A_DATA A_DATA A_DATA A_DATA  
0
4
3
7
0
1
2
3
7
NC  
A_DATB A_DATB A_DATB  
A_OE  
A_CKE  
A_GWE  
A_CS2  
A_CS1  
VSS A_DATA A_DATA A_DATA A_DATA  
5
6
4
5
6
A_ADR  
A_ADR  
A_ADR  
A_ADR  
A_ADR  
NC  
A_ADV A_BWEB VSS A_BWEA  
A_ZZ A_ADR  
A_ADR A_ADR  
A_ADR A_ADR  
A_ADR1 A_ADR0  
A_ADR A_ADR  
A_ADR A_ADR  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
A_CLK  
VSS  
F
G
H
J
K
L
M
N
P
R
T
A_ADR  
A_DATC  
A_CS2 A_BWEC VSS A_BWED A_LBO A_ADR  
A_DATC A_DATC A_DATC  
VSS A_DATD A_DATD A_DATD A_DATD  
3
NC  
VSS  
VSS  
VSS  
NC  
0
1
2
3
0
1
2
VSS  
A_DATC4 A_DATC5 A_DATC6 A_DATC7 VSS A_DATD4 A_DATD5 A_DATD6 A_DATD7  
VSS  
VSS  
B_DATB0  
B_DATB4  
B_ADR  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
B_DATB1 B_DATB2 B_DAT  
B_DATB5 B_DATB6 B_DAT  
3
7
VSS B_DATA0 B_DATA1 B_DATA2 B_DATA3  
VSS B_DATA4 B_DATA5 B_DATA6 B_DATA7  
NC  
B_ADR  
B_ADR  
B_ADR  
B_ADR  
B_ADR  
NC  
B_OE  
B_CKE  
B_GWE  
B_CS2  
B_CS1  
B_ADV B_BWEB  
VSS B_BWEA  
B_ZZ  
VCC  
B_ADR  
VCC  
B_ADR B_ADR  
B_ADR B_ADR  
B_ADR1 B_ADR0  
B_ADR B_ADR  
B_ADR B_ADR  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
B_CLK  
VSS  
VCC  
VCC  
VCC  
VCC  
VCC  
U
V
W
NC  
B_DATC  
B_CS2  
B_BWEc  
VSS B_BWED B_LBO B_ADR  
B_DATC B_DATC B_DATC  
VSS B_DATD B_DATD B_DATD B_DATD  
NC  
VSS  
4
5
6
7
4
5
6
7
VSS  
B_DATC  
B_DATC B_DATC B_DATC  
VSS B_DATD B_DATD B_DATD B_DATD  
0 1 2  
0
1
2
3
3
White Electronic Designs Corporation • (502) 366-5151• www.whiteedc.com  
April 2002 Rev. 0  
ECO #15203  
1234567...13

中文翻译

下载PDF

与WED2ZLRSP01S-BC相关器件

型号 品牌 获取价格 描述 数据表
WED3C7410E16M400BC WEDC

获取价格

 		RISC Microprocessor Multichip Package
WED3C7410E16M400BC MICROSEMI

获取价格

 		RISC Microprocessor, 400MHz, CMOS, CBGA225, 21 X 25 MM, CERAMIC, BGA-225
WED3C7410E16M-400BC MICROSEMI

获取价格

 		400MHz, RISC PROCESSOR, CBGA225, 21 X 25 MM, CERAMIC, BGA-225
WED3C7410E16M400BH9C WEDC

获取价格

 		7410E RISC Microprocessor HiTCETM Multichip Package
WED3C7410E16M400BH9I WEDC

获取价格

 		7410E RISC Microprocessor HiTCETM Multichip Package
WED3C7410E16M400BH9M WEDC

获取价格

 		7410E RISC Microprocessor HiTCETM Multichip Package
WED3C7410E16M-400BH9M MICROSEMI

获取价格

 		RISC Microprocessor, 400MHz, CMOS, CBGA255, 21 X 25 MM, 3.20 MM HEIGHT, CERAMIC, BGA-255
WED3C7410E16M400BHC WEDC

获取价格

 		7410E RISC Microprocessor HiTCETM Multichip Package
WED3C7410E16M-400BHC MICROSEMI

获取价格

 		RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA255, 21 X 25 MM, 3.20 MM HEIGHT, CERAMIC, B
WED3C7410E16M400BHI WEDC

获取价格

 		7410E RISC Microprocessor HiTCETM Multichip Package

与WED2ZLRSP01S-BC相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证