是否Rohs认证: | 不符合 | 生命周期: | Transferred |
包装说明: | 21 X 25 MM, CERAMIC, BGA-225 | Reach Compliance Code: | unknown |
风险等级: | 5.78 | 地址总线宽度: | 32 |
位大小: | 64 | 边界扫描: | YES |
最大时钟频率: | 133 MHz | 外部数据总线宽度: | 64 |
格式: | FLOATING POINT | 集成缓存: | YES |
JESD-30 代码: | R-CBGA-B225 | 长度: | 25 mm |
低功率模式: | NO | 端子数量: | 225 |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | BGA |
封装等效代码: | BGA255,16X16,50 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 1.8,2.5,3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 3.14 mm | 速度: | 400 MHz |
子类别: | Microprocessors | 最大供电电压: | 1.9 V |
最小供电电压: | 1.7 V | 标称供电电压: | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | MILITARY | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 21 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
WED3C7410E16M-400BHC | MICROSEMI |
获取价格 |
RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA255, 21 X 25 MM, 3.20 MM HEIGHT, CERAMIC, B |
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WED3C7410E16M400BHI | WEDC |
获取价格 |
7410E RISC Microprocessor HiTCETM Multichip Package |
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WED3C7410E16M-400BHI | MICROSEMI |
获取价格 |
RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA255, 21 X 25 MM, 3.20 MM HEIGHT, CERAMIC, B |
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WED3C7410E16M400BHM | WEDC |
获取价格 |
7410E RISC Microprocessor HiTCETM Multichip Package |
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WED3C7410E16M400BI | WEDC |
获取价格 |
RISC Microprocessor Multichip Package |
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WED3C7410E16M400BI | MICROSEMI |
获取价格 |
RISC Microprocessor, 64-Bit, 400MHz, CMOS, CBGA225, 21 X 25 MM, CERAMIC, BGA-225 |
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WED3C7410E16M-400BI | MICROSEMI |
获取价格 |
400MHz, RISC PROCESSOR, CBGA225, 21 X 25 MM, CERAMIC, BGA-225 |
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WED3C7410E16M400BM | WEDC |
获取价格 |
RISC Microprocessor Multichip Package |
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WED3C7410E16M400BM | MICROSEMI |
获取价格 |
RISC Microprocessor, 400MHz, CMOS, CBGA225, 21 X 25 MM, CERAMIC, BGA-225 |
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WED3C7410E16M-400BM | MICROSEMI |
获取价格 |
RISC Microprocessor, 400MHz, CMOS, CBGA225, 21 X 25 MM, CERAMIC, BGA-225 |
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