是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | BGA, | 针数: | 225 |
Reach Compliance Code: | compliant | ECCN代码: | 3A001.A.3 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.78 |
地址总线宽度: | 32 | 边界扫描: | YES |
最大时钟频率: | 133 MHz | 外部数据总线宽度: | 64 |
格式: | FLOATING POINT | 集成缓存: | YES |
JESD-30 代码: | R-CBGA-B225 | 低功率模式: | NO |
端子数量: | 225 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | BGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | 速度: | 400 MHz |
最大供电电压: | 1.9 V | 最小供电电压: | 1.7 V |
标称供电电压: | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
WED3C7410E16M-400BI | MICROSEMI |
获取价格 |
400MHz, RISC PROCESSOR, CBGA225, 21 X 25 MM, CERAMIC, BGA-225 | |
WED3C7410E16M400BM | WEDC |
获取价格 |
RISC Microprocessor Multichip Package | |
WED3C7410E16M400BM | MICROSEMI |
获取价格 |
RISC Microprocessor, 400MHz, CMOS, CBGA225, 21 X 25 MM, CERAMIC, BGA-225 | |
WED3C7410E16M-400BM | MICROSEMI |
获取价格 |
RISC Microprocessor, 400MHz, CMOS, CBGA225, 21 X 25 MM, CERAMIC, BGA-225 | |
WED3C7410E16M-400BX | ETC |
获取价格 |
RISC Microprocessor Multichip Package | |
WED3C7410E16M450BC | WEDC |
获取价格 |
RISC Microprocessor Multichip Package | |
WED3C7410E16M450BC | MICROSEMI |
获取价格 |
RISC PROCESSOR, CBGA225, 21 X 25 MM, CERAMIC, BGA-225 | |
WED3C7410E16M-450BC | MICROSEMI |
获取价格 |
RISC Microprocessor, 450MHz, CMOS, CBGA225, 21 X 25 MM, CERAMIC, BGA-225 | |
WED3C7410E16M450BH9C | WEDC |
获取价格 |
7410E RISC Microprocessor HiTCETM Multichip Package | |
WED3C7410E16M-450BH9C | MICROSEMI |
获取价格 |
100MHz, RISC PROCESSOR, CBGA255, 21 X 25 MM, 3.20 MM HEIGHT, CERAMIC, BGA-255 |