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WED3C7410E16MC400BHI PDF预览

WED3C7410E16MC400BHI

更新时间: 2024-02-15 01:35:44
品牌 Logo 应用领域
美高森美 - MICROSEMI 时钟外围集成电路
页数 文件大小 规格书
15页 356K
描述
RISC Microprocessor, 400MHz, CMOS, PBGA255, BGA-255

WED3C7410E16MC400BHI 技术参数

生命周期:Transferred包装说明:BGA-255
Reach Compliance Code:unknown风险等级:5.7
Is Samacsys:N其他特性:LG-MAX;WD-MAX;SEATED HT-CALCULATED
地址总线宽度:32边界扫描:YES
最大时钟频率:133 MHz外部数据总线宽度:64
格式:FLOATING POINT集成缓存:YES
JESD-30 代码:R-PBGA-B255长度:25.25 mm
低功率模式:YES端子数量:255
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装形状:RECTANGULAR封装形式:GRID ARRAY
认证状态:Not Qualified座面最大高度:3.11 mm
速度:400 MHz最大供电电压:1.9 V
最小供电电压:1.7 V标称供电电压:1.8 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
宽度:21.21 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

WED3C7410E16MC400BHI 数据手册

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WED3C7410E16MC-XBHX  
White Electronic Designs  
7410E RISC Microprocessor HiTCE™ Multichip Package  
The WED3C7410E16MC-XBHX is offered in Commercial  
OVERVIEW  
(0°C to +70°C), industrial (-40°C to +85°C) and military  
The WEDC 7410E/SSRAM multichip package is targeted  
(-55°C to +125°C) temperature ranges and is well suited  
for high performance, space sensitive, low power systems  
for embedded applications such as missiles, aerospace,  
and supports the following power management features:  
ight computers, re control systems and rugged critical  
doze, nap, sleep and dynamic power management.  
systems.  
The WED3C7410E16MC-XBHX multichip package  
consists of:  
FEATURES  
„
„
7410E AltiVec™ RISC processor  
„
Footprint compatible with WED3C7410E16M-XBX,  
WED3C7558M-XBX and WED3C750A8M-200BX  
Dedicated 2MB SSRAM L2 cache, congured as  
256Kx72  
„
Implementation of Altivectechnology instruction  
set  
„
„
„
„
21mmx25mm, 255 HiTCE™ Ball Grid Array (CBGA)  
Core frequency = 450 or 400MHz  
„
„
Optional, high-bandwidth MPX bus interface  
HiTCE™ interposer for TCE compatibility to  
laminate substrates for increased Board level  
reliability  
Maximum L2 Cache frequency = 200MHz  
Maximum 60x Bus frequency = 133MHz**  
„
Available with eutectic or high lead solder balls  
* This product is subject to change without notice.  
** At a maximum of 60x bus frequency of 133MHz, the maximum conguration core  
frequency is 400MHz.  
FIGURE 1 – MULTI-CHIP PACKAGE DIAGRAM  
AltiVec™ is a trademark of Motorola Inc.  
HiTCE™ is a trademark of Kyocera Corp.  
October 2007  
Rev. 0  
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  

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