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WED3C7558M300BC PDF预览

WED3C7558M300BC

更新时间: 2024-01-16 22:02:27
品牌 Logo 应用领域
WEDC 微处理器
页数 文件大小 规格书
13页 531K
描述
RISC Microprocessor Multichip Package

WED3C7558M300BC 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:CERAMIC, CGA-255Reach Compliance Code:unknown
风险等级:5.8地址总线宽度:32
位大小:64边界扫描:YES
最大时钟频率:66 MHz外部数据总线宽度:64
格式:FIXED POINT集成缓存:YES
JESD-30 代码:S-CBGA-X255JESD-609代码:e0
长度:21 mm低功率模式:YES
端子数量:255最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:CGA封装等效代码:BGA225(UNSPEC)
封装形状:SQUARE封装形式:GRID ARRAY
峰值回流温度(摄氏度):NOT SPECIFIED电源:2,3.3 V
认证状态:Not Qualified座面最大高度:4.4 mm
速度:300 MHz子类别:Microprocessors
最大供电电压:2.1 V最小供电电压:1.9 V
标称供电电压:2 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:UNSPECIFIED
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:21 mm
uPs/uCs/外围集成电路类型:MICROPROCESSOR, RISCBase Number Matches:1

WED3C7558M300BC 数据手册

 浏览型号WED3C7558M300BC的Datasheet PDF文件第2页浏览型号WED3C7558M300BC的Datasheet PDF文件第3页浏览型号WED3C7558M300BC的Datasheet PDF文件第4页浏览型号WED3C7558M300BC的Datasheet PDF文件第5页浏览型号WED3C7558M300BC的Datasheet PDF文件第6页浏览型号WED3C7558M300BC的Datasheet PDF文件第7页 
WED3C7558M-XBX  
White Electronic Designs  
RISC Microprocessor Multichip Package  
OVERVIEW  
The WEDC 755/SSRAM multichip package is targeted for  
high performance, space sensitive, low power systems and  
supports the following power management features: doze,  
nap, sleep and dynamic power management.  
The WED3C7558M-XBX is offered in Commercial (0°C  
to +70°C), industrial (-40°C to +85°C) and military (-55°C  
to +125°C) temperature ranges and is well suited for  
embedded applications such as missiles, aerospace,  
flight computers, fire control systems and rugged critical  
systems.  
The WED3C7558M-XBX multichip package consists of:  
755 RISC processor  
Dedicated 1MB SSRAM L2 cache, configured as  
128Kx72  
* This product is subject to change without notice.  
21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)  
FEATURES  
Core Frequency/L2 Cache Frequency (300MHz/  
150MHz, 350MHz/175MHz)  
Footprint compatible with WED3C750A8M-200BX  
Footprint compatible with Motorola MPC 745  
Maximum 60x Bus frequency = 66MHz  
FIGURE 1 – MULTI-CHIP PACKAGE DIAGRAM  
August 2002  
Rev. 7  
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  

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