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WED3C755BM300BC

更新时间： 2024-01-17 12:16:44

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WED3C755BM300BC 数据手册

The WED3C7558M-XBX is offered in Commercial (0°C to

+70°C), industrial (-40°C to +85°C) and military (-55°C to

+125°C) temperature ranges and is well suited for embed-

ded applications such as missiles, aerospace, flight com-

puters, fire control systems and rugged critical systems.

The WEDC 755/SSRAM multichip package is targeted for

high performance, space sensitive, low power systems and

supports the following power management features: doze,

nap, sleep and dynamic power management.

*This data sheet describes a product that is subject to change without notice.

The WED3C7558M-XBX multichip package consists of:

• 755 RISC processor

• Dedicated 1MB SSRAM L2 cache, configured as

128Kx72

n Footprint compatible with WED3C750A8M-200BX

n Footprint compatible with Motorola MPC 745

• 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)

• Core Frequency/L2 Cache Frequency (300MHz/

150MHz, 350MHz/175MHz)

• Maximum 60x Bus frequency = 66MHz

April 2002 Rev. 6

White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

12 3 4 5 6 7...13

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