Datasheet > WED3C755E8MC350BC

WED3C755E8MC350BC

更新时间： 2024-10-02 09:10:15

品牌	Logo	应用领域
美高森美 - MICROSEMI		时钟外围集成电路
页数	文件大小	规格书
14页	311K
描述
350MHz, RISC PROCESSOR, CBGA255, 21 X 25 MM, CERAMIC, BGA-255

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WED3C755E8MC-XBX

White Electronic Designs

RISC Microprocessor Multichip Package

OVERVIEW

The WEDC 755E/SSRAM multichip package is targeted

for high performance, space sensitive, low power systems

and supports the following power management features:

doze, nap, sleep and dynamic power management.

The WED3C755E8MC-XBX is offered in Commercial

(0°C to +70°C), industrial (-40°C to +85°C) and military

(-55°C to +125°C) temperature ranges and is well suited

for embedded applications such as missiles, aerospace,

ﬂight computers, ﬁre control systems and rugged critical

systems.

The WED3C755E8MC-XBX multichip package consists

of:

ꢀ

755 RISC processor (E die revision)

FEATURES

Dedicated 1MB SSRAM L2 cache, conﬁgured as

128Kx72

ꢀ

Footprint compatible with WED3C7558M-XBX and

WED3C750A8M-200BX

ꢀ

21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)

ꢀ

Footprint compatible with Motorola MPC 745

Core Frequency/L2 Cache Frequency (300MHz/

150MHz, 350MHz/175MHz)

Replaces WED3C755E8M-XBX and

WED3C755E8MF-XBX

ꢀ

Maximum 60x Bus frequency = 66MHz

• SSRAM JTAG function no longer available

* This product is subject to change without notice.

FIGURE 1 – MULTI-CHIP PACKAGE DIAGRAM

SSRAM

μP

755E

SSRAM

November 2007

Rev. 1

White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

12 3 4 5 6 7...14

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与WED3C755E8MC350BC相关器件

型号	品牌	获取价格	描述	数据表
WED3C755E8MC-350BC	MICROSEMI	获取价格	350MHz, RISC PROCESSOR, CBGA255, 21 X 25 MM, CERAMIC, BGA-255
WED3C755E8MC350BI	MICROSEMI	获取价格	350MHz, RISC PROCESSOR, CBGA255, 21 X 25 MM, CERAMIC, BGA-255
WED3C755E8MC350BM	MICROSEMI	获取价格	350MHz, RISC PROCESSOR, CBGA255, 21 X 25 MM, CERAMIC, BGA-255
WED3C755E8MC-350BM	MICROSEMI	获取价格	350MHz, RISC PROCESSOR, CBGA255, 21 X 25 MM, CERAMIC, BGA-255
WED3C755E8M-XBX	WEDC	获取价格	RISC MICROPROCESSOR MULTI-CHIP PACKAGE
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