是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
包装说明: | 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Reach Compliance Code: | unknown |
风险等级: | 5.84 | Is Samacsys: | N |
地址总线宽度: | 32 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 66 MHz |
外部数据总线宽度: | 64 | 格式: | FIXED POINT |
集成缓存: | YES | JESD-30 代码: | R-CBGA-B255 |
低功率模式: | YES | 端子数量: | 255 |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | BGA |
封装等效代码: | BGA255,16X16,50 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 2,3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 3.85 mm | 速度: | 300 MHz |
子类别: | Microprocessors | 最大供电电压: | 2.1 V |
最小供电电压: | 1.9 V | 标称供电电压: | 2 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | MILITARY | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
WED3C755E8M300BM | WEDC |
获取价格 |
RISC MICROPROCESSOR MULTI-CHIP PACKAGE |
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WED3C755E8M-300BM | ETC |
获取价格 |
Microprocessor |
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WED3C755E8M350BC | WEDC |
获取价格 |
RISC MICROPROCESSOR MULTI-CHIP PACKAGE |
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WED3C755E8M-350BC | ETC |
获取价格 |
Microprocessor |
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WED3C755E8M-350BH9C | WEDC |
获取价格 |
RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PI |
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WED3C755E8M-350BHC | WEDC |
获取价格 |
RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PI |
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WED3C755E8M-350BHI | WEDC |
获取价格 |
RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PI |
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WED3C755E8M-350BHM | WEDC |
获取价格 |
RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PI |
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WED3C755E8M350BI | WEDC |
获取价格 |
RISC MICROPROCESSOR MULTI-CHIP PACKAGE |
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WED3C755E8M-350BI | ETC |
获取价格 |
Microprocessor |
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