Datasheet > WED3C755E8M-350BC

WED3C755E8M-350BC

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WED3C755E8M-350BC 数据手册

WED3C755E8M-XBX

RISC Microprocessor Multichip Package

OVERVIEW

The WED3C755E8M-XBX is offered in Commercial

(0°C to +70°C), industrial (-40°C to +85°C) and mili-

tary (-55°C to +125°C) temperature ranges and is

well suited for embedded applications such as mis-

siles, aerospace, flight computers, fire control sys-

tems and rugged critical systems.

The WEDC 755E/SSRAM multichip package is tar-

geted for high performance, space sensitive, low

power systems and supports the following power

management features: doze, nap, sleep and dynamic

power management.

*This data sheet describes a product that is subject to change without notice.

The WED3C755E8M-XBX multichip package con-

sists of:

FEATURES

• 755 RISC processor (E die revision)

n Footprint compatible with WED3C7558M-XBX and

WED3C750A8M-200BX

• Dedicated 1MB SSRAM L2 cache, configured as

128Kx72

n Footprint compatible with Motorola MPC 745

• 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)

• Core Frequency/L2 Cache Frequency (300MHz/

150MHz, 350MHz/175MHz)

• Maximum 60x Bus frequency = 66MHz

FIGꢀ 1 MULTI-CHIP PACKAGE DIAGRAM

White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom

September 2002 Revꢀ 0

12 3 4 5 6 7...13

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型号	品牌	获取价格	描述	数据表
WED3C755E8M-350BH9C	WEDC	获取价格	RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PI
WED3C755E8M-350BHC	WEDC	获取价格	RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PI
WED3C755E8M-350BHI	WEDC	获取价格	RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PI
WED3C755E8M-350BHM	WEDC	获取价格	RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PI
WED3C755E8M350BI	WEDC	获取价格	RISC MICROPROCESSOR MULTI-CHIP PACKAGE
WED3C755E8M-350BI	ETC	获取价格	Microprocessor
WED3C755E8M350BM	WEDC	获取价格	RISC MICROPROCESSOR MULTI-CHIP PACKAGE
WED3C755E8M-350BM	ETC	获取价格	Microprocessor
WED3C755E8MC300BC	MICROSEMI	获取价格	350MHz, RISC PROCESSOR, CBGA255, 21 X 25 MM, CERAMIC, BGA-255
WED3C755E8MC300BI	MICROSEMI	获取价格	350MHz, RISC PROCESSOR, CBGA255, 21 X 25 MM, CERAMIC, BGA-255