Datasheet > WED3C7558M-XBX

WED3C7558M-XBX

更新时间： 2024-01-28 08:49:47

品牌	Logo	应用领域
WEDC		微处理器
页数	文件大小	规格书
13页	531K
描述
RISC Microprocessor Multichip Package

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WED3C7558M-XBX 数据手册

WED3C7558M-XBX

White Electronic Designs

RISC Microprocessor Multichip Package

OVERVIEW

The WEDC 755/SSRAM multichip package is targeted for

high performance, space sensitive, low power systems and

supports the following power management features: doze,

nap, sleep and dynamic power management.

The WED3C7558M-XBX is offered in Commercial (0°C

to +70°C), industrial (-40°C to +85°C) and military (-55°C

to +125°C) temperature ranges and is well suited for

embedded applications such as missiles, aerospace,

ﬂight computers, ﬁre control systems and rugged critical

systems.

The WED3C7558M-XBX multichip package consists of:

ꢀ

755 RISC processor

Dedicated 1MB SSRAM L2 cache, conﬁgured as

128Kx72

* This product is subject to change without notice.

ꢀ

21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)

FEATURES

Core Frequency/L2 Cache Frequency (300MHz/

150MHz, 350MHz/175MHz)

ꢀ

Footprint compatible with WED3C750A8M-200BX

Footprint compatible with Motorola MPC 745

ꢀ

Maximum 60x Bus frequency = 66MHz

FIGURE 1 – MULTI-CHIP PACKAGE DIAGRAM

August 2002

Rev. 7

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

12 3 4 5 6 7...13

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