VS-FCSP0530TR
Vishay Semiconductors
www.vishay.com
FlipKY®,
Chip Scale Package Schottky Barrier Rectifier, 0.5 A
FEATURES
• Ultra low VF to footprint area
• Very low profile (< 0.6 mm)
• Low thermal resistance
• Supplied tested and on tape and reel
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Reverse polarity protection
• Current steering
FlipKY®
• Freewheeling
• Flyback
• Oring
DESCRIPTION
PRODUCT SUMMARY
Vishay’s FlipKY® product family utilizes wafer level
chip scale packaging to deliver Schottky diodes with the
lowest VF to PCB footprint area in industry. The three pad
0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy
only 1.08 mm2 of board space. The anode and cathode
connections are made through solder bump pads on one
side of the silicon enabling designers to strategically place
the diodes on the PCB. This design not only minimizes
board space but also reduces thermal resistance and
inductance, which can improve overall circuit efficiency.
IF(AV)
0.5 A
30 V
VR
VF at IF
0.33 V
50 μA
15 mA
150 °C
5 mJ
I
RM max. at 25 °C
I
RM max. at 125 °C
TJ max.
EAS
Typical applications include hand-held, portable equipment
such as cell phones, MP3 players, bluetooth, GPS, PDAs,
and portable hard disk drives where space savings and
performance are crucial.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
VRRM
IF(AV)
IFSM
CHARACTERISTICS
MAX.
30
UNITS
V
Rectangular waveform
0.5
A
190
VF
0.5 Apk, TJ = 125 °C
0.33
V
TJ
- 55 to 150
°C
VOLTAGE RATINGS
PARAMETER
SYMBOL
VR
VS-FCSP0530TR
UNITS
Maximum DC reverse voltage
30
V
Maximum working peak reverse voltage
VRWM
Revision: 04-Jul-11
Document Number: 94492
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000