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TPCP8501 PDF预览

TPCP8501

更新时间: 2024-02-26 16:20:52
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体晶体管功率双极晶体管开关光电二极管
页数 文件大小 规格书
5页 227K
描述
TOSHIBA Transistor Silicon NPN Epitaxial Type

TPCP8501 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Lifetime Buy包装说明:SMALL OUTLINE, R-PDSO-F8
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.44
Is Samacsys:N最大集电极电流 (IC):2 A
集电极-发射极最大电压:100 V配置:SINGLE
最小直流电流增益 (hFE):80JESD-30 代码:R-PDSO-F8
元件数量:1端子数量:8
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:NPN
最大功率耗散 (Abs):3.3 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

TPCP8501 数据手册

 浏览型号TPCP8501的Datasheet PDF文件第2页浏览型号TPCP8501的Datasheet PDF文件第3页浏览型号TPCP8501的Datasheet PDF文件第4页浏览型号TPCP8501的Datasheet PDF文件第5页 
TPCP8501  
TOSHIBA Transistor Silicon NPN Epitaxial Type  
TPCP8501  
Switching Applications  
DC-DC Converter Applications  
Unit: mm  
0.33±0.05  
A
M
0.05  
5
8
High DC current gain : h  
= 100 to 300 (I = 0.3 A)  
FE C  
Low collector-emitter saturation : V  
= 0.2 V (max)  
CE (sat)  
High-speed switching : t = 100 ns (typ.)  
f
0.475  
1
4
B
B
M
0.05  
0.65  
Absolute Maximum Ratings (Ta = 25°C)  
2.9±0.1  
A
0.8±0.05  
Characteristics  
Collector-base voltage  
Symbol  
Rating  
Unit  
V
S
0.025  
+0.1  
S
0.28  
0.17±0.02  
-0.11  
V
180  
150  
100  
7
CBO  
V
+0.13  
-0.12  
CEX  
CEO  
EBO  
1.12  
1.12  
Collector-emitter voltage  
Emitter-base voltage  
Collector current  
V
V
A
V
V
+0.13  
-0.12  
+0.1  
0.28  
-0.11  
5.Emitter  
1.Collector  
2.Collector  
3.Collector  
4.Base  
DC (Note 1)  
I
C
2.0  
4.0  
6.Collector  
7.Collector  
8.Collector  
Pulse (Note 1 )  
I
CP  
Base current  
I
0.2  
A
B
JEDEC  
t = 10s  
DC  
3.3  
1.3  
Collector power  
dissipation (t = 10s)  
JEITA  
P
(Note 2)  
W
C
TOSHIBA  
2-3V1A  
Junction temperature  
T
150  
°C  
°C  
j
Weight: 0.017 g (typ.)  
Storage temperature range  
T
55 to 150  
stg  
Note 1: Please use devices on condition that the junction temperature is below 150°C.  
Note 2: Mounted on FR4 board (glass epoxy, 1.6 mm thick, Cu area: 645 mm2)  
Note 3: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly  
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute  
maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
1
2006-11-13  

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