Datasheet > TPCP8504(TE85L)

TPCP8504(TE85L)

更新时间： 2024-09-24 20:04:31

品牌	Logo	应用领域
东芝 - TOSHIBA		/
页数	文件大小	规格书
5页	196K
描述
TRANSISTOR,BJT,NPN,10V V(BR)CEO,2A I(C),TSOP

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中文翻译

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技术参数
数据手册

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TPCP8504(TE85L) 技术参数

是否Rohs认证：	不符合	生命周期：	Active
包装说明：	,	Reach Compliance Code：	unknown
风险等级：	5.69	最大集电极电流 (IC)：	2 A
配置：	Single	最小直流电流增益 (hFE)：	400
最高工作温度：	150 °C	极性/信道类型：	NPN
最大功率耗散 (Abs)：	2.8 W	子类别：	Other Transistors
表面贴装：	YES	Base Number Matches：	1

TPCP8504(TE85L) 数据手册

TPCP8504

TOSHIBA Transistor Silicon NPN Epitaxial Type

TPCP8504

High Speed Switching Applications

Unit: mm

DC-DC Converter Applications

0.33±0.05

0.05

•

High DC current gain : h

= 400 to 1000 (I = 0.2 A)

FE C

Low collector-emitter saturation : V

= 0.12 V (max)

CE (sat)

High-speed switching : t = 25 ns (typ.)

0.475

0.05

0.65

2.9±0.1

0.8±0.05

Absolute Maximum Ratings (Ta = 25°C)

0.025

+0.1

0.28

0.17±0.02

-0.11

Characteristics

Collector-base voltage

Symbol

Rating

Unit

+0.13

-0.12

1.12

CBO

CEO

EBO

+0.13

-0.12

Collector-emitter voltage

Emitter-base voltage

+0.1

0.28

5.Emitter

1.Collector

2.Collector

3.Collector

4.Base

-0.11

6.Collector

7.Collector

8.Collector

DC (Note 1)

2.0

3.5

Collector current

Pulse (Note 1 )

JEDEC

―

Base current

0.2

JEITA

t = 10s

2.8

1.2

Collector power

dissipation (Note 2)

TOSHIBA

2-3V1A

Junction temperature

150

°C

Weight: 0.017 g (typ.)

Storage temperature range

−55 to 150

stg

Note 1: Please use devices on condition that the junction temperature is below 150°C.

Note 2: Mounted on FR4 board (glass epoxy, 1.6 mm thick, Cu area: 645 mm²)

Note 3: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly

even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute

maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

2006-11-13

12 3 4 5

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